MBO SN96.5 AG3 CU0.5 5/10 A11 - 500G lead free solder wire is a high-quality product specifically designed for soldering applications in electronics assembly and repair. It features a wire diameter of 0.5 mm and a melting point of 217 °C, ensuring precise melting and bonding.
The solder composition includes 96.5% tin, 3% silver, and 0.5% copper, delivering excellent electrical conductivity and mechanical strength. The rosin flux type embedded within the solder wire acts as a no-clean agent, preventing residue build-up and ensuring long-lasting solder joints.
Available in a weight of 500 grams, this solder wire comes in A11 spools, making it ideal for soldering connectors to a wide range of substrates, enhancing compatibility with different materials. The RT15 spools, known for fast wetting properties, are particularly suitable for surface-mount device (SMD) repairs and precision electronic work.
Manufactured in France under rigorous quality control, this solder wire meets demanding industrial standards without containing any lead, making it environmentally friendly and RoHS compliant.
The solder wire contains 96.5% tin, 3% silver, and 0.5% copper providing reliable conductivity. It is a no-clean solder wire featuring rosin flux type to ensure clean soldering without residue. Designed in wire form with a diameter of 0.5 mm for precise and fine soldering tasks.
This product weighs 500 grams, providing ample material for various soldering jobs. Manufactured in France to high quality standards and with no hazardous lead content. A11 spools are optimized for soldering connectors to all substrates for diverse PCB requirements.
RT15 spools offer fast wetting characteristics suitable for SMD repair work.
This Solder Wire is widely used in electronics manufacturing, laboratory applications, industrial circuit board assembly, and electronics repair environments. Its lead-free composition and precise melting point ensure safety and reliability in sensitive electronics tasks.
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