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Multicore Lead Solder Wire 0.56 mm Diameter Activated Rosin Flux 179°C Melting Point 250g 291708
Specifications
| Country of Origin | Malaysia |
|---|---|
| Brand | Multicore |
| Model | 291708 |
| Melting Point | 179°C |
| Product Weight | 250g |
| Wire Diameter | 0.56mm |
| Product Form | Wire |
| Percent Lead | 36% |
| Percent Silver | 2% |
| Percent Tin | 62% |
| Flux Type | Activated Rosin |
| Multicore Wire, 0.7mm Lead solder, 179°C Melting PointBrand | Multicore |
| Stannol Wire, 0.5mm Lead solder, 183°C Melting PointBrand | Stannol |
| Loctite Wire SolderBrand | Loctite |
Key Features
- This solder wire contains 36% lead and 62% tin to ensure a strong bond.
- The wire is infused with activated rosin flux for improved solder flow and joint reliability.
- Features a low melting point of 179°C, minimizing thermal damage during repairs.
- Includes 2% silver to enhance electrical conductivity and mechanical strength.
- The product is presented in a 250 gram coil, suitable for electronics and delicate soldering tasks.
- Conforms to BS219 Grade 62S and DIN1707 standards for quality assurance.
- Manufactured in Malaysia, ensuring consistent industrial-grade quality.
Product Description
Multicore 291708 lead solder wire features a precise 0.56 mm diameter and a eutectic melting point of 179°C, making it ideal for professional electronics soldering and repair work.
This wire solder consists of 36% lead, 62% tin, and 2% silver, providing a reliable joint with superior electrical and mechanical properties. The solder wire incorporates activated rosin flux which promotes better solder flow, reduces oxidation, and ensures a clean, strong bond on fabricated boards and components.
The low melting point reduces the risk of thermal damage to components during soldering, suitable for sensitive electronic assemblies and repairs. Contains 36% lead and 62% tin composition for optimal melting and bonding.
Includes 2% silver for improved durability and conductivity. Activated rosin flux with 5 cores enhances solder performance. Eutectic melting point of 179°C minimizes repair risks to components. Product weight is 250 grams, optimal for multiple soldering applications.
Conforms to international quality standards BS219 Grade 62S and DIN1707. Manufactured in Malaysia ensuring high product reliability. This Solder Wire is well-suited for industrial, electronics manufacturing, laboratory repair, HVAC equipment soldering, and precision electrical joining tasks.
Explore more soldering wires and accessories in the Power Tools category at EnvMart for professional-grade equipment.
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Frequently Asked Questions
The solder wire has a diameter of 0.56 mm.
It has a eutectic melting point of 179°C.
This solder wire consists of 36% lead, 62% tin, and 2% silver.
It uses activated rosin flux, which enhances solder flow and joint reliability.
The product is presented in a coil weighing 250 grams.
It is manufactured in Malaysia.
It conforms to BS219 Grade 62S and DIN1707 standards for quality assurance.
It is suitable for industrial, electronics manufacturing, laboratory repair, HVAC equipment soldering, and precision electrical joining tasks.
The 2% silver content enhances electrical conductivity and mechanical strength of the solder joints.
The low melting point of 179°C minimizes thermal damage during soldering, making it suitable for sensitive electronic assemblies.
The wire incorporates activated rosin flux which reduces oxidation and promotes better solder flow, ensuring a clean bond.
The product is in the form of wire, specifically designed for soldering applications.
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