Multicore Lead Free Solder Wire 0.71 mm Diameter Rosin Based Flux 219°C Melting Point 250g 756-8884

RS PRO 756-8884 Lead Free Solder Wire features a 0.71 mm wire diameter combined with a rosin based flux formulation, melting at 219°C. It is designed for use in electronics manufacturing, repair, prototyping, and production where lead-free soldering is mandated or preferred.

This solder wire is composed of 96.5% tin, 3% silver, and 0.5% copper, ensuring high solder joint reliability with environmentally safe, lead-free characteristics. The 219°C melting point facilitates efficient melting and solidification, ideal for both SMD and through-hole components. The rosin based flux chemistry produces low levels of clear flux residue which can be safely left on the PCB after soldering, simplifying the manufacturing process.

The product meets industry standards J-STD 006 and J-STD 004 for solder and flux classification, ensuring quality and consistent performance in industrial and commercial soldering applications.

Wire diameter of 0.71 mm for precision soldering. Lead free composition with 3% silver content. Melting point of 219°C for efficient solder melts. Rosin based flux formulation leaving minimal residue. Compatible with all PCB finishes and components.

Ideal for lead-free applications in electronics manufacturing and repair. Complies with widely recognized soldering standards.

This solder wire is widely used in electronics assembly, laboratory prototyping, industrial manufacturing, and soldering repair work. Its lead-free formulation makes it environmentally compliant with RoHS directives and suitable for consumer electronic device production. It offers excellent wetting properties and strength for reliable, durable solder joints.

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