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MBO Lead Free Solder Wire 0.38 mm Diameter, 217 °C Melting Point, Rosin Based Flux 250g 756-8875
Specifications
| Country of Origin | India |
|---|---|
| Brand | MBO |
| Model | 756-8875 |
| Melting Point | 217°C |
| Product Weight | 250g |
| Wire Diameter | 0.38mm |
| Standards/Approvals | J-STD 006, J-STD 004 |
| Product Form | Wire |
| Percent Lead | 0% |
| Percent Silver | 3% |
| Percent Tin | 96.5% |
| Flux Type | Rosin Based |
| Percent Copper | 0.5% |
| MBO Wire, 0.35 mm Lead Free Solder, 217 °C Melting PointBrand | MBO |
| Alpha Wire, 0.4mm Solder, 215°C Melting PointBrand | Alpha |
Key Features
- Contains 3% silver and 96.5% tin for superior solder quality.
- Features a rosin based flux that leaves low clear residue.
- Wets well to all PCB and component finishes for reliable joints.
- Complies with RoHS and standards J-STD 004 and J-STD 006.
- Weighs 250 grams, suitable for extended soldering work.
- Provides a no-clean solder option reducing the need for post-solder cleaning.
Product Description
RS PRO 756-8875 lead free solder wire is designed for industrial and electronics manufacturing, featuring a 0.38 mm diameter and a melting point of 217 °C. It contains 3% silver, 96.5% tin, and 0.5% copper, with a rosin based flux ensuring excellent wetting and minimal residue on solder joints.
Since July 1, 2006, the Restriction of Hazardous Substances (RoHS) directive restricts lead-based materials to protect human health. RS PRO SAC305 wire meets this directive, making it ideal for lead-free electronics assembly and repair applications.
Its formulation offers improved wetting on all printed circuit board finishes and components, spreading similar to RA flux types. The no-clean nature of the flux leaves a low level of clear residue safe to leave on assemblies, minimizing the need for cleaning and improving production speeds.
The solder's melting point at 217 °C allows for quick melt and cooling, facilitating efficient solder joints. It is suited for both Surface Mount Device (SMD) and through-hole component soldering used in prototyping, repair, and production environments.
RS PRO’s SAC305 wire also complies with industry standards including J-STD 004 and J-STD 006, ensuring high reliability and performance for industrial, laboratory, commercial electronics manufacturing, and HVAC applications.
Contains 3% silver and 96.5% tin providing enhanced mechanical strength. Rosin based flux is no-clean and leaves minimal residue. Compatible with all PCB finishes and component types for versatile use. Ideal for lead-free soldering applications, supporting environmental and safety standards.
Meets RoHS requirements protecting against hazardous lead content. Standard size 0.38 mm wire diameter provides precision control during soldering. Suitable weight of 250 grams per spool for convenience and longer usage.
This solder wire is the professional choice for electronics repair, manufacturing, and prototyping tasks where lead-free solder is mandated or preferred. Its quality and compliance make RS PRO SAC305 Solder Wire the smart choice for ensuring high-quality solder joints with minimal environmental impact.
Explore more industrial-grade soldering materials and accessories in the RS PRO range at EnvMart for your electronics and electrical assembly needs.
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Frequently Asked Questions
The solder wire has a diameter of 0.38 mm.
It has a melting point of 217 °C.
This solder contains 3% silver, 96.5% tin, and 0.5% copper, making it lead-free.
It uses a rosin-based flux that leaves minimal residue and is classified as no-clean.
The solder wire complies with J-STD 004 and J-STD 006 standards, as well as RoHS requirements.
The solder wire weighs 250 grams per spool, suitable for extended soldering work.
Yes, it is suitable for both Surface Mount Device (SMD) and through-hole component soldering.
The solder wire is manufactured in India.
It provides excellent wetting on all PCB finishes and components, ensuring reliable solder joints with minimal cleaning required.
This solder wire is ideal for electronics manufacturing, repair, and prototyping tasks where lead-free solder is preferred.
The rosin-based flux leaves a low level of clear residue, which is safe to leave on assemblies, minimizing the need for cleaning.
The lead-free composition protects human health and complies with environmental safety standards, making it suitable for lead-free electronics assembly.
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