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MBO Lead Free Solder Wire 0.5 mm Diameter, 217 °C Melting Point, Rosin Flux, 500g SN96.5 AG3 CU0.5 5/10 RT15 - 500G

Category Soldering Brand MBO Condition New

Specifications

Country of Origin France
Brand MBO
Model SN96.5 AG3 CU0.5 5/10 RT15 - 500G
Melting Point 217°C
Product Weight 500g
Wire Diameter 0.5mm
Product Form Wire
Percent Lead 0%
Percent Silver 3%
Percent Tin 96.5%
Flux Type Rosin
Percent Copper 0.5%
Stannol Wire, 0.5mm Lead solder, 183°C Melting PointBrand Stannol
MBO Wire, 0.5 mm Lead Free Solder, 217 °C Melting PointBrand MBO

Key Features

  • Lead free with 0% lead content ensuring environmentally friendly soldering.
  • Melting point of 217 °C allows stable and consistent flow.
  • Contains 3% silver and 0.5% copper, with 96.5% tin providing excellent mechanical strength.
  • Rosin flux type enables effective solder joint formation.
  • Suitable for surface mount device (SMD) repairs and connector soldering.
  • Manufactured in France ensuring high quality standards.

Product Description

MBO SN96.5 AG3 CU0.5 5/10 RT15 - 500G is a lead free solder wire with 0.5 mm diameter, designed for precise and reliable soldering applications in industrial and electronics assembly settings.

This solder wire features a melting point of 217 °C, facilitating smooth flow during soldering and providing strong mechanical joints. The alloy composition includes 96.5% tin, 3% silver, and 0.5% copper, delivering excellent strength and durability for electronic component soldering.

The rosin flux type incorporated in this wire ensures effective fluxing action, reducing oxidation and hindering formation of poor solder joints. With a net weight of 500 grams, it provides a sufficient quantity for small to medium scale assembly operations and repairs.

Manufactured in France, this product adheres to stringent quality and reliability standards demanded in professional environments. Lead free with 0% lead content ensuring environmentally friendly soldering. Melting point of 217 °C allows stable and consistent flow.

Contains 3% silver and 0.5% copper, with 96.5% tin providing excellent mechanical strength. Rosin flux type enables effective solder joint formation. Net weight of 500 grams suitable for various soldering tasks. Ideal for surface mount device (SMD) repairs and connector soldering applications.

Manufactured in France ensuring high quality standards.

This lead free solder wire is well suited for industrial soldering, electronics manufacturing, electrical repairs, and precision assembly tasks. It supports reliable and clean joints essential for professional and laboratory use.

Explore a wide range of soldering products and related accessories in the Industrial Tools & Equipment category at EnvMart for comprehensive solutions to your Soldering needs.

MBO Lead Free Solder Wire 0.5 mm Diameter, 217 °C Melting Point, Rosin Flux, 500g SN96.5 AG3 CU0.5 5/10 RT15 - 500G
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Frequently Asked Questions

The melting point of this solder wire is 217 °C, allowing for stable and consistent flow during soldering applications.

The diameter of this solder wire is 0.5 mm, making it suitable for precise soldering tasks.

This lead-free solder wire contains 96.5% tin, 3% silver, and 0.5% copper, providing excellent mechanical strength for solder joints.

The solder wire uses rosin flux, which ensures effective solder joint formation by reducing oxidation.

The net weight of this solder wire is 500 grams, suitable for various soldering tasks in small to medium scale operations.

This solder wire is manufactured in France, adhering to high quality standards.

The key benefits include environmentally friendly soldering due to 0% lead content, strong mechanical joints, and effective fluxing action.

The 3% silver and 0.5% copper content enhance the strength and durability of the solder joints, which is crucial for reliable electronic connections.

Rosin flux improves soldering performance by preventing oxidation and ensuring clean, effective solder joints during the soldering process.

The product form of this solder is wire, designed for easy application in various soldering tasks.

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