MBO Lead Free Solder Wire 0.5 mm Diameter, 217 °C Melting Point, Rosin Flux, 500g SN96.5 AG3 CU0.5 5/10 RT15 - 500G

MBO SN96.5 AG3 CU0.5 5/10 RT15 - 500G is a lead free solder wire with 0.5 mm diameter, designed for precise and reliable soldering applications in industrial and electronics assembly settings.

This solder wire features a melting point of 217 °C, facilitating smooth flow during soldering and providing strong mechanical joints. The alloy composition includes 96.5% tin, 3% silver, and 0.5% copper, delivering excellent strength and durability for electronic component soldering.

The rosin flux type incorporated in this wire ensures effective fluxing action, reducing oxidation and hindering formation of poor solder joints. With a net weight of 500 grams, it provides a sufficient quantity for small to medium scale assembly operations and repairs.

Manufactured in France, this product adheres to stringent quality and reliability standards demanded in professional environments. Lead free with 0% lead content ensuring environmentally friendly soldering. Melting point of 217 °C allows stable and consistent flow.

Contains 3% silver and 0.5% copper, with 96.5% tin providing excellent mechanical strength. Rosin flux type enables effective solder joint formation. Net weight of 500 grams suitable for various soldering tasks. Ideal for surface mount device (SMD) repairs and connector soldering applications.

Manufactured in France ensuring high quality standards.

This lead free solder wire is well suited for industrial soldering, electronics manufacturing, electrical repairs, and precision assembly tasks. It supports reliable and clean joints essential for professional and laboratory use.

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