MBO Lead Solder Paste 179°C Melting Point, Rosin Flux, Paste Form, 62% Tin CRÈME SN62 PB AG2 SIRIUS 1 - SERINGUE AUTO 100G

MBO CRÈME SN62 PB AG2 SIRIUS 1 - SERINGUE AUTO 100G is a lead solder paste designed for demanding electronic assembly environments. It features a specialized formulation of 62% tin, 36% lead, and 2% silver, providing reliable electrical and mechanical properties required for various precision soldering tasks. With a melting point of 179°C, it is suitable for fine pitch work, including stencil printing in reflow soldering operations.

The paste's rosin-based flux type delivers excellent wetting and adhesion, resulting in strong, conductive solder joints while leaving minimal, neutral, and colourless residue. Its no-clean formulation minimizes post-solder cleaning requirements, making it ideal for modern electronic manufacturing. The solder paste is chlorine-free, helping ensure compatibility with sensitive electronic components and maintaining workplace safety.

The fine pitch capability (400 μm) supports advanced surface mount device soldering, with high activity for consistent performance. Provided in a 100g syringe, application remains precise and convenient, supporting both manual and automated reflow processes. Standards compliance with NFC90550, J-STD-006, and EN 29453 guarantees reliable, globally accepted soldering performance.

Common industrial and laboratory use cases include electronics manufacturing, PCB assembly, prototyping labs, rework/repair stations, and any environment where high-quality, leaded soldering paste is required. The product is manufactured in France, ensuring consistent quality backed by technical documentation and conformity statements.

The paste form and no-clean chemistry streamline production workflows, appealing to both small batch prototyping and high-volume manufacturing sectors. Whether used in industrial electronics shops, commercial PCB plants, or engineering laboratories, this Solder Paste solves both precision and reliability needs for complex electronic assemblies.

Paste form solder for precise stencil printing in reflow soldering operations. Composition includes 62% tin, 36% lead, and 2% silver for optimal electrical performance. Rosin-based flux type ensures good wetting and clean joints with minimal residue.

Melting point at 179°C suitable for fine pitch applications (400 μm) with high activity. Supplied in a 100-gram syringe for convenient, accurate application. No-clean formulation, chlorine-free, neutral and colourless residue.

Compliant with standards NFC90550, J-STD-006, and EN 29453. Explore more soldering solutions and electronics assembly consumables from MBO and across the EnvMart Electronics Components category.