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CHIPQUIK No Clean Solder Paste 63Sn/37Pb 35 g Syringe, RoHS, J-STD-004B SMD291AX10T5
Specifications
| Country of Origin | Canada |
|---|---|
| Brand | CHIPQUIK |
| Model | SMD291AX10T5 |
| Package Type | Syringe |
| Package Size | 35 g |
| Standards/Approvals | RoHS, J-STD-004B |
Key Features
- Contains 63Sn/37Pb solder alloy in a 10cc syringe with T5 mesh.
- Supports printing speeds up to 100 mm/sec for efficient processing.
- Offers a long stencil life allowing extended usability.
- Leaves clear residue compatible with inspecting solder joints.
- Wide process window for versatility across board finishes.
- Dispense grade suitable for enclosed print heads.
- Passes BONO test ensuring reliability and quality.
Product Description
CHIPQUIK SMD291AX10T5 is a no clean solder paste supplied in a 35 g syringe, composed of 63% tin and 37% lead alloy. This product conforms to RoHS requirements and the J-STD-004B standard, reflecting adherence to international safety and quality norms.
This solder paste features a T5 mesh size within a 10cc syringe, designed to enable precise application suitable for surface-mount technology (SMT) assembly. It facilitates printing speeds reaching up to 100 mm per second, improving manufacturing throughput in electronics assembly lines.
With an extended stencil life, this solder paste remains effective over lengthy production runs, reducing downtime. The wide process window enables soldering across different board finishes, ensuring compatibility with a large variety of circuit boards.
The product leaves a clear, non-corrosive residue after soldering, which aids in inspection and does not compromise the circuit’s reliability. It is dispense grade and compatible with enclosed print heads, providing flexible use in automated or manual SMT processes. Additionally, it passes the BONO test, underscoring its superior wetting capability and low voiding characteristics, critical for high-quality solder joints.
Originating from Canada, this solder paste is used widely in industrial electronics manufacturing, laboratory R&D, and commercial repair applications where quality and conformity to standards are paramount.
Contains 63Sn/37Pb solder alloy in a 10cc syringe with T5 mesh. Supports printing speeds up to 100 mm/sec for efficient processing. Offers a long stencil life allowing extended usability. Leaves clear residue compatible with inspecting solder joints.
Wide process window for versatility across board finishes. Dispense grade suitable for enclosed print heads. Passes BONO test ensuring reliability and quality. Explore EnvMart's extensive range of Solder Pastes and accessories for reliable and precise electronic assembly solutions.
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Frequently Asked Questions
This solder paste is composed of a 63% tin and 37% lead alloy, supplied in a 35 g syringe.
It conforms to RoHS requirements and the J-STD-004B standard, reflecting adherence to international safety and quality norms.
It supports printing speeds of up to 100 mm per second, enhancing manufacturing throughput in electronics assembly.
The solder paste features a T5 mesh size, designed for precise application suitable for surface-mount technology (SMT) assembly.
It leaves a clear, non-corrosive residue that is compatible with inspecting solder joints, ensuring circuit reliability.
The solder paste originates from Canada.
It is packaged in a syringe, specifically a 35 g syringe.
This model offers a long stencil life, allowing for extended usability over lengthy production runs.
It is widely used in industrial electronics manufacturing, laboratory R&D, and commercial repair applications.
Passing the BONO test indicates its superior wetting capability and low voiding characteristics, which are critical for high-quality solder joints.
Yes, it is dispense grade and compatible with enclosed print heads, making it flexible for both automated and manual SMT processes.
The model number is SMD291AX10T5.
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