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MBO Lead Free Solder Wire 0.35 mm Diameter, 217 °C Melting Point SN96.5 AG3 CU0.5 0,35/10 A11 - 100G
Specifications
| Country of Origin | France |
|---|---|
| Brand | MBO |
| Model | SN96.5 AG3 CU0.5 0,35/10 A11 - 100G |
| Melting Point | 217°C |
| Product Weight | 100g |
| Wire Diameter | 0.35mm |
| Product Form | Wire |
| Percent Lead | 0% |
| Percent Silver | 3% |
| Percent Tin | 96.5% |
| Flux Type | Rosin |
| Percent Copper | 0.5% |
Key Features
- The solder wire is composed of 96.5% tin, 3% silver, and 0.5% copper, ensuring optimal conductivity.
- Offers rosin flux type for improved solder joint quality and no-clean application compatibility.
- Available in a 100 g spool, suitable for various electronic soldering tasks.
- Designed with no lead content, compliant with environmental standards.
- The A11 activation flux spools are ideal for soldering connectors to all substrates.
- RT15 spools provide fast wetting, making them suitable for SMD repair and precision work.
- Manufactured in France, ensuring high-quality European production standards.
Product Description
MBO SN96.5 AG3 CU0.5 0,35/10 A11 - 100G lead free solder wire features a diameter of 0.35 mm and melts at 217 °C, designed for precision electronics soldering in laboratory, industrial, and electronics manufacturing environments.
The solder wire has an alloy composition of 96.5% tin, 3% silver, and 0.5% copper, providing excellent electrical and mechanical properties. It is designed with a rosin flux core for no-clean soldering processes ensuring reliable joint formation without requiring post-solder cleaning.
This product is ideal for soldering connectors to a wide range of substrates with activated no-clean A11 flux spools. The RT15 variant offers fast wetting properties suitable for surface mount device (SMD) repairs and detailed electronics work.
Supplied in a compact 100 g spool, the solder wire ensures efficient handling and precise application in electronics assembly, repair, and manufacturing. Its lead-free composition complies with environmental and safety standards, making it suitable for use in commercial and industrial electronics production.
The solder wire consists of 96.5% tin, 3% silver, and 0.5% copper for optimal alloy performance. Rosin-based flux ensures improved wetting and solder joint quality. The product melts at a precise 217 °C temperature for controlled soldering.
Available in 100 g spools designed for ease of use and storage. Lead-free design meets environmental and regulatory compliance. A11 flux spools cater to soldering connectors on various substrates. RT15 flux spools provide fast wetting ideal for SMD repairs.
This Solder Wire is widely used in electronics manufacturing, laboratory testing, industrial repair work, and applications requiring precise and reliable solder joints. It is an essential component in assembly lines for consumer electronics, telecommunications, and electronic instrumentation.
Explore more high-quality electronic components and soldering supplies in the Electronics & Electricals category at EnvMart.
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Frequently Asked Questions
The solder wire has a melting point of 217 °C, which is suitable for precision soldering tasks.
This model features a diameter of 0.35 mm, making it suitable for detailed soldering applications.
The solder wire is composed of 96.5% tin, 3% silver, and 0.5% copper, ensuring optimal conductivity and performance.
It uses a rosin flux type, which is designed for no-clean soldering processes, ensuring reliable joint formation without the need for post-solder cleaning.
The solder wire is supplied in a spool that weighs 100 g, allowing for efficient handling during soldering tasks.
The lead-free design complies with environmental and safety standards, making it suitable for use in commercial and industrial electronics production.
It is packaged in a compact 100 g spool, designed for ease of use and storage during soldering tasks.
The alloy composition of 96.5% tin, 3% silver, and 0.5% copper provides excellent electrical and mechanical properties for reliable solder joints.
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