onsemi 30 V 1 A Schottky Diode, Surface Mount DO-214AC Package MBRA130LT3G

onsemi MBRA130LT3G Schottky Diode is a high-performance semiconductor device designed for efficient rectification and polarity protection in various electronic and automotive systems. This diode uses the Schottky barrier principle employing a barrier metal to minimize forward voltage drop while managing reverse current effectively.

Encased in a DO-214AC surface mount package, which measures 4.32mm in length, 2.6mm width, and 2mm height, it offers a compact form factor suitable for applications where size and weight are critical. The 2-pin, single diode configuration supports currents up to 1 Ampere continuously, with the ability to handle surge currents up to 25 Amperes.

The device operates reliably over a broad temperature range from -55°C to 125°C, meeting automotive-grade standards (AEC-Q101) and environmental requirements such as RoHS compliance. Its low forward voltage of 410mV contributes to energy efficiency, making it ideal for high-frequency switching and freewheeling diode applications.

Applications include power supply circuits, automotive electronics, industrial automation, and other electronic assemblies requiring compact, high-reliability Schottky diodes. The epoxy moulded case ensures mechanical robustness and stress protection, facilitating automated surface mount assembly processes.

Maximum continuous forward current of 1 Ampere supports moderate power applications. Peak reverse repetitive voltage rating is 30 Volts, suitable for low voltage circuits. Low maximum forward voltage of 410 millivolts ensures high efficiency.

Operating temperature range from -55°C to 125°C enables use in diverse environments. Pin count of 2 and single diode configuration in a compact 4.32 x 2.6 x 2 mm package. Meets RoHS and automotive standard AEC-Q101 for quality and reliability.

Lightweight epoxy moulded case with robust mechanical protection. Peak non-repetitive forward surge current of 25 Amperes for transient conditions. Epoxy encapsulation provides stress protection and device longevity. Designed for automated board assembly in industrial, automotive, and electronic component applications.

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