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onsemi P-Channel Enhancement Mode MOSFET 900 mA 30 V SOT-23 NDS352AP

Category Discrete Semiconductor Brand onsemi Condition New

Specifications

Country of Origin India
Brand onsemi
Height 940μm
Length 2.92mm
Model NDS352AP
Width 1.4mm
Mount Type Surface
Series NDS352AP
Maximum Operating Temperature 150°C
Package Type SOT-23
Minimum Operating Temperature -55°C
Pin Count 3
Channel Type Type P
Maximum Continuous Drain Current Id 900mA
Maximum Drain Source Voltage Vds 30V
Maximum Drain Source Resistance Rds 500mΩ
Channel Mode Enhancement
Maximum Power Dissipation Pd 500mW
Typical Gate Charge Qg @ Vgs 2nC
Maximum Gate Source Voltage Vgs -20, +20V
Forward Voltage Vf -1.2V

Key Features

  • High-density DMOS technology offers low on-state resistance and exceptional ruggedness.
  • Maximum power dissipation rated at 500 mW ensuring reliable operation.
  • Wide operating temperature range from -55°C to 150°C for versatile use.
  • Compact dimensions with a length of 2.92 mm, width of 1.4 mm, and height of 940 μm.
  • Applications include load switching, DC/DC converters, battery protection, and power management control.
  • Surface mount device ideal for automated PCB assembly.
  • Robust design for use in industrial, consumer electronics, and automotive equipment.

Product Description

The onsemi NDS352AP is a P-Channel Enhancement Mode MOSFET designed with ON Semiconductor's proprietary high cell density DMOS technology, delivering low on-state resistance and high ruggedness for fast switching applications.

This transistor supports a maximum continuous drain current of 900 mA and a maximum drain-source voltage of 30 V, making it suitable for efficient power control in various electronic circuits.

Encapsulated in a compact 3-pin SOT-23 surface mount package, the device measures 2.92 mm in length, 1.4 mm in width, and 940 μm in height, allowing for high-density PCB layouts and automated assembly processes.

Operating over a broad temperature range from -55°C to 150°C, the NDS352AP ensures reliable performance under demanding environmental conditions, including industrial and automotive applications.

Key electrical features include a maximum power dissipation of 500 mW, typical gate charge of 2 nC at Vgs, and a maximum gate-source voltage rating of -20 V to +20 V. The device is optimized for load switching, DC/DC conversion, battery protection circuits, and power management control systems.

Voltage controlled P-Channel silicon MOSFET optimized for fast switching. High-density cell design minimizing on-state resistance (Rds(on) = 500 mΩ). Compact footprint aids in space-saving circuit designs. Enhanced ruggedness with a maximum operating temperature of 150°C.

Suitable for embedded applications like DC motor control and power management. Surface mount technology compatible, easing manufacturing processes. Ideal for use in industrial electronics, automotive power systems, consumer devices, and telecommunications equipment where efficient power switching is critical.

Explore onsemi's extensive semiconductor product portfolio in the Semiconductor section of EnvMart for complementary power management components.

Explore more products in our Discrete Semiconductor category.

onsemi P-Channel Enhancement Mode MOSFET 900 mA 30 V SOT-23 NDS352AP
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Frequently Asked Questions

The maximum continuous drain current for this model is 900 mA.

The maximum drain-source voltage rating is 30 V.

It operates over a temperature range from -55°C to 150°C.

This model has dimensions of 2.92 mm in length, 1.4 mm in width, and 940 μm in height.

The maximum power dissipation is rated at 500 mW.

It is encapsulated in a compact 3-pin SOT-23 surface mount package.

The typical gate charge at Vgs is 2 nC.

The on-state resistance (Rds(on)) is 500 mΩ.

This model is suitable for load switching, DC/DC converters, battery protection, and power management control.

The maximum gate-source voltage rating is -20 V to +20 V.

It has a pin count of 3.

The channel type is P-Channel Enhancement Mode.

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