Samtec TSM Series Vertical Surface Pin Header 14 Contacts 2.54 mm Pitch 2 Row Unshrouded TSM-107-01-F-DV

Samtec TSM-107-01-F-DV is a vertical surface mount pin header from the TSM series, designed for reliable board-to-board connections in electronic assemblies. This pin header features 14 male contacts arranged in 2 rows with a precise 2.54 mm pitch. The housing is made from durable black liquid crystal polymer, ensuring insulation and mechanical stability in various industrial and commercial environments.

The contacts are fabricated from phosphor bronze material, offering excellent conductivity and mechanical resilience. The plating consists of gold flash on the post for superior contact performance and matte tin on the tail for effective soldering. This combination ensures both durability and solderability.

Operating temperature range extends from -55°C to 125°C, enabling use in harsh temperature conditions prevalent in industrial, manufacturing, and electronic test environments. The pin header supports a voltage rating of up to 475 VAC, suitable for multiple electronic power applications.

Featuring a vertical orientation and an unshrouded design, the component is optimized for straightforward soldering and versatile PCB layout configurations. The surface mount type mount allows for efficient manufacturing process integration.

Constructed with black liquid crystal polymer housing for durability. Features phosphor bronze contact material with gold flash or matte tin plating. Designed for board-to-board connection with surface mount type. Operates reliably in temperature range from -55°C to 125°C.

Rated for voltage up to 475 volts AC. Vertical orientation and unshrouded, providing easy soldering access. Ideal for electronic components and PCB header applications. Termination type is solder for secure attachment to printed circuit boards.

This pin header component is typically used in industrial electronic equipment, telecommunications, test and measurement devices, and commercial PCB assemblies requiring robust and reliable connectivity. It supports designers and engineers in creating compact, high-performance electronics with efficient and durable interconnections.

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