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| Country of Origin | India |
|---|---|
| Voltage | 318V |
| Brand | Samtec |
| Orientation | Straight |
| Current | 2.2A |
| Model | ERF8 |
| Mount Type | Surface |
| Housing Material | Liquid Crystal Polymer |
| Contact Material | Beryllium Copper Alloy |
| Series | ERF8 |
| Termination Type | Solder |
| Maximum Operating Temperature | 125°C |
| Sub Type | Rugged High-Speed Socket Strip |
| Minimum Operating Temperature | -55°C |
| Number of Rows | 2 |
| Positions | Up to 200 |
| Pitch | 0.8mm |
| Contact Plating | Gold |
| Number of Contacts | 40 |
| Connector System | Board-to-Board |
| Stacking Height | 18mm |
| Row Pitch | 4.5mm |
| Stack Height | 7.00 mm - 16.00 mm |
The Samtec ERF8-020-05.0-S-DV-L-K-TR is a high-density, straight surface mount PCB socket engineered for high-speed, rugged board-to-board interconnections in advanced electronic designs. This model features a total of 40 gold-plated beryllium copper contacts in two rows, designed with a compact 0.8mm pitch to maximize efficiency in space-constrained printed circuit boards.
Utilizing surface mount technology, installation on the PCB is streamlined, ensuring precise component placement and optimal electrical performance. The housing is formed from advanced liquid crystal polymer, delivering outstanding chemical resistance and thermal stability for use in demanding industrial and commercial electronic environments.
This PCB Socket is well-suited to high-speed and high-reliability signal applications, rated up to 2.2A and 318V. The robust combination of rugged contact materials and a finished gold plating beneath ensures low contact resistance and extended wear life. The straight orientation and board-to-board connector system support stacking heights of 18mm, with compatibility for varied board configurations. The device maintains performance within a broad temperature range from -55°C to 125°C.
With an integrated locking feature and carefully engineered contact geometry, the socket provides reliable, vibration-resistant mating and smooth insertion and extraction cycles. The 4.5mm row spacing and compact format make the ERF8 suitable for high-density, mission-critical designs in industrial automation, instrumentation, test and measurement, digital systems, and embedded computing platforms.
40 contacts, 2 rows, 0.8mm contact pitch for dense, high-speed PCBs. Surface mount termination for fast and precise PCB assembly. Gold-plated beryllium copper contacts for optimal conductivity, reliability, and durability.
Liquid crystal polymer insulator ensures chemical, mechanical, and thermal robustness. 318V voltage handling, 2.2A rated current, and operation from -55°C to 125°C. Stacking height: 18mm; row pitch: 4.5mm; up to 200 positions available across family variants.
Applications include high-speed computing, industrial automation, embedded systems, and test equipment. Explore related PCB connectors, headers, and sockets in the Samtec portfolio under Electronics Components at EnvMart.
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