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| Country of Origin | India |
|---|---|
| Brand | Infineon |
| Height | 8.77mm |
| Length | 10.54mm |
| Model | IRF3205PBF |
| Width | 4.69mm |
| Mount Type | Through Hole |
| Series | HEXFET |
| Maximum Operating Temperature | 175°C |
| Package Type | TO-220 |
| Minimum Operating Temperature | -55°C |
| Pin Count | 3 |
| Channel Type | N |
| Maximum Continuous Drain Current Id | 110A |
| Maximum Drain Source Voltage Vds | 55V |
| Maximum Drain Source Resistance Rds | 8mΩ |
| Channel Mode | Enhancement |
| Maximum Power Dissipation Pd | 200W |
| Typical Gate Charge Qg @ Vgs | 146nC |
| Maximum Gate Source Voltage Vgs | -20, +20V |
| Forward Voltage Vf | 1.3V |
| N-channel MOSFET,IRF3205 98A 55VBrand | International Rectifier |
Infineon IRF3205PBF HEXFET N-Channel MOSFET is a high-performance power semiconductor designed for industrial and electronic applications requiring efficient power management. It supports a maximum continuous drain current of 110A and a maximum drain-source voltage of 55V, making it suitable for demanding power switching tasks.
The device employs enhancement mode channel operation and comes housed in a TO-220 package with 3 pins, facilitating effective thermal management and reliable through-hole mounting.
Operating temperatures range from -55°C to 175°C, accommodating harsh operating environments. The MOSFET features a low on-resistance (8 mΩ) and a typical gate charge of 146 nC at Vgs, enabling fast switching and reduced power loss.
Thermal characteristics include a junction-to-case thermal resistance of 0.75°C/W, which can be further improved by using a heatsink to maintain optimal device temperature during operation.
This device is widely used in power conversion circuits, motor control in industrial and commercial electronics, battery management systems, and high-frequency switching circuits for consumer electronics.
This MOSFET provides excellent avalanche capability and stable performance in enhancement mode. The TO-220 packaging supports effective heat dissipation with proper thermal management. Its compact dimensions (Height: 8.77mm, Length: 10.54mm, Width: 4.69mm) support space-constrained designs.
Designed for through-hole mounting, enabling robust mechanical and electrical connections. Suitable for applications requiring high current and voltage handling capabilities. Explore the comprehensive range of Infineon semiconductor devices on EnvMart for advanced electronics and industrial solutions.
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