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| Country of Origin | India |
|---|---|
| Brand | onsemi |
| Height | 1.5mm |
| Length | 5mm |
| Model | FDS6912A |
| Width | 4mm |
| Mount Type | Surface |
| Series | PowerTrench |
| Maximum Operating Temperature | 150°C |
| Package Type | SOIC |
| Minimum Operating Temperature | -55°C |
| Pin Count | 8 |
| Number of Elements per Chip | 2 |
| Channel Type | N |
| Maximum Continuous Drain Current Id | 6A |
| Maximum Drain Source Voltage Vds | 30V |
| Maximum Drain Source Resistance Rds | 44mΩ |
| Channel Mode | Enhancement |
| Maximum Power Dissipation Pd | 1.6W |
| Typical Gate Charge Qg @ Vgs | 5.8nC |
| Maximum Gate Source Voltage Vgs | -20, +20V |
| Forward Voltage Vf | 0.75V |
| Transistor Configuration | Isolated |
onsemi FDS6912A Isolated PowerTrench 2 N-Channel MOSFET is a specialized semiconductor transistor designed for efficient power management in electronic circuits. It supports a maximum continuous drain current of 6 Amperes and a maximum drain-source voltage of 30 Volts. Encapsulated in an 8-pin SOIC surface-mount package, this device offers reliable electrical performance with a low drain-source resistance of 44 milliohms, minimizing conduction losses.
This PowerTrench MOSFET incorporates a soft reverse recovery body diode that eliminates the need for external snubber circuits and allows for fast switching in synchronous rectification applications typically found in AC/DC power supplies. It delivers a typical gate charge of 5.8 nanocoulombs, facilitating low power gate drive requirements.
The device operates efficiently within a wide temperature range from -55°C up to 150°C, making it suitable for harsh industrial, manufacturing, and electronic applications. With a maximum power dissipation of 1.6 Watts, it supports compact and thermally managed designs.
Mechanical dimensions are compact with a length of 5 mm, width of 4 mm, and height of 1.5 mm, making it ideal for space-constrained PCB layouts. The transistor configuration is isolated with two elements per chip to enhance performance and reliability.
PowerTrench technology ensures increased efficiency and system power density. Soft body diode enhances switching performance and system simplification. Suitable for industrial, manufacturing, consumer electronics, and power management applications.
Surface mount package allows automated assembly and high-density mounting. Operating voltage and current ratings fit medium power applications. Robust temperature handling extends device reliability in demanding environments.
Compact footprint for high component density circuit boards. Ideal for synchronous rectification in AC/DC power supplies, battery management, and motor drives. Package and pin count designed for standard PCB mounting processes.
Eliminates need for additional snubber components, reducing external parts count.
This product is supplied new and sourced from India. It is recommended for engineers and designers working in power electronics, semiconductors, and embedded circuit applications. Explore more onsemi semiconductor components in the EnvMart Electronics & Electricals category for quality and reliability.
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