Winslow 2.54 mm Pitch Vertical 28 Way Through Hole Stamped Pin Open Frame DIL Socket 10A W3128/3TRC

Winslow W3128/3TRC is a high-quality 28 way Dual Inline Package (DIL) stamped IC socket designed with a 2.54 mm pitch and a vertical orientation, providing reliable electrical connections for integrated circuits in complex PCB assemblies.

This open frame DIL Socket features stamped phosphor bronze contacts with tin plating, ensuring excellent conductivity, low contact resistance, and long-term durability under demanding industrial conditions.

The housing is engineered from polybutylene terephthalate, a robust and heat-resistant plastic, enabling the socket to operate efficiently within temperatures ranging from -65°C to +150°C suitable for automotive, industrial electronics, and laboratory instrumentation.

The socket supports through hole mounting with solder termination for secure and permanent PCB installations. Its compact depth of 10.14 mm and length of 35.53 mm allow space-efficient circuit designs without compromising performance.

The W3100 series features a low-profile stackable design, including a 35 degree angled contact to prevent IC leg misalignment during insertion, thereby improving assembly reliability and reducing damage risks.

This component is ideal for use in electrical and electronic manufacturing, laboratory instrumentation, test and measurement setups, and commercial electronics where high-density and dependable IC socket solutions are required.

The socket includes 28 stamped pin contacts arranged vertically with 2.54 mm pitch. Open frame construction facilitates easy IC package insertion and removal. Durable tin plating on contacts ensures longevity and consistent performance.

Polybutylene terephthalate housing withstands mechanical and thermal stresses. Wide operating temperature range from -65°C to +150°C accommodates varied environments. Through hole solder terminations allow strong PCB mounting.

Series W3100 design enhances mechanical stability and stacking capability. Angled contacts reduce IC leg damage risk during assembly. Compact dimensions optimize PCB space usage. Suitable for industrial, laboratory, and commercial electronics applications.

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