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E-TEC 2.54 mm Pitch Vertical 14 Way Through Hole Turned Pin Open Frame DIL Socket, 1A LOP-314-S083-95

Category DIL Socket Brand E-TEC Condition New

Specifications

Country of Origin India
Voltage 100V
Brand E-TEC
Orientation Vertical
Current 1A
Frame Type Open Frame
Length 17.78mm
Model LOP-314-S083-95
Depth 10.16mm
Width 2.41mm
Mount Type Through Hole
Housing Material Polybutylene Terephthalate
Contact Material Beryllium Copper Alloy
Series LOP/SLP
Termination Type Solder
Maximum Operating Temperature 125°C
Pitch 2.54mm
Contact Plating Tin, Gold
Number of Contacts 14
Pin Type Turned
Row Width 7.62mm

Key Features

  • This DIL socket features 14 contacts with 2.54 mm pitch for precise component placement.
  • Constructed with beryllium copper alloy contact material providing excellent conductivity.
  • Open frame construction with a vertical orientation supports space-saving PCB mounting.
  • Contacts are tin and gold plated to ensure reliable connection and corrosion resistance.
  • The housing is made from polybutylene terephthalate, offering durability and thermal stability.
  • Supports a maximum operating temperature of 125°C for demanding applications.
  • Designed for through-hole mounting with solder termination for secure PCB installation.
  • Suited for use in electronics assembly, repair, and testing applications requiring low-profile DIL sockets.

Product Description

E-TEC LOP-314-S083-95 2.54 mm Pitch Vertical 14 Way Through Hole Turned Pin Open Frame DIL Socket, rated at 1A and 100V, is ideal for electronics assemblies requiring compact, reliable connections.

This super low profile socket incorporates beryllium copper alloy contacts with tin and gold plating to provide excellent electrical conductivity and corrosion resistance. The turned pin design ensures dependable insertion into standard 0.8 mm PCB holes.

The open frame construction and vertical orientation allow for minimal board height of 7.62 mm, beneficial in stacked board or compact system designs. The polybutylene terephthalate housing offers robustness and thermal stability to 125°C, suitable for demanding industrial and laboratory environments.

Sockets can be juxtaposably mounted without throughput loss, allowing multiple units to be combined in tight spacing scenarios. The solder termination facilitates secure and durable PCB mounting.

Applications include use in programming EPROMs and similar memory devices, industrial control systems, and electronic prototyping requiring low-profile socket interfaces. This socket provides 14 contact points spaced at 2.54 mm pitch for standard DIP IC compatibility.

The frame depth is 10.16 mm with an overall length of 17.78 mm and width of 2.41 mm. Contact materials and plating are selected to ensure long life and dependable operation in industrial and commercial electronics. Designed for through-hole mount technology (THT) providing strong mechanical and electrical connections to printed circuit boards.

Supports currents up to 1A at 100V, making it suitable for low power electronic circuits. Explore EnvMart's broad range of electronic components designed for professional electronics manufacturing, laboratory instruments, and industrial applications.

E-TEC 2.54 mm Pitch Vertical 14 Way Through Hole Turned Pin Open Frame DIL Socket, 1A LOP-314-S083-95
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Frequently Asked Questions

This model is rated for a maximum current of 1A and a maximum voltage of 100V.

The contacts are made from beryllium copper alloy and are plated with tin and gold to ensure excellent conductivity and corrosion resistance.

It features a pitch of 2.54 mm and has 14 contacts.

The overall length is 17.78 mm, width is 2.41 mm, and depth is 10.16 mm.

The maximum operating temperature is 125°C, making it suitable for demanding applications.

It is designed for through-hole mounting with solder termination, ensuring secure installation on printed circuit boards.

The housing is constructed from polybutylene terephthalate, which offers durability and thermal stability.

This model features a vertical orientation, allowing for efficient space utilization on PCBs.

Yes, the open frame construction allows for juxtaposed mounting without throughput loss, making it suitable for tight spacing scenarios.

It is suited for use in electronics assembly, repair, testing applications, and programming EPROMs and similar memory devices.

It features a turned pin design, which ensures dependable insertion into standard 0.8 mm PCB holes.

This DIL socket is part of the LOP/SLP series.

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