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| Country of Origin | India |
|---|---|
| Brand | Infineon |
| Length | 6.35mm |
| Model | IPLK70R2K0P7ATMA1 |
| Mount Type | Surface |
| Series | IPL |
| Maximum Operating Temperature | 150°C |
| Package Type | ThinPAK 5x6 |
| Minimum Operating Temperature | -55°C |
| Standards/Approvals | RoHS |
| Pin Count | 5 |
| Automotive Standard | AEC-Q101 |
| Channel Type | N |
| Maximum Continuous Drain Current Id | 9.4A |
| Maximum Drain Source Voltage Vds | 700V |
| Maximum Drain Source Resistance Rds | 1.2mΩ |
| Maximum Power Dissipation Pd | 25.5W |
| Typical Gate Charge Qg @ Vgs | 80nC |
| Maximum Gate Source Voltage Vgs | 3V |
| Forward Voltage Vf | 900mV |
Infineon IPLK70R2K0P7ATMA1 is a high-performance N-Channel MOSFET designed for power switching applications requiring up to 9.4 A continuous drain current and 700 V drain-source voltage. This device is housed in a ThinPAK 5x6 surface mount package characterized by a compact footprint (5x6 mm²) and a low height of just 1 mm, which aids in achieving compact PCB layouts with high power density.
Its exceptionally low on-resistance (1.2 mΩ maximum) and low switching losses make it ideal for efficient energy conversion in industrial, automotive, and power management circuits. The device includes an integrated ESD protection diode to improve robustness and reliability.
The MOSFET supports a maximum power dissipation of 25.5 W and operates efficiently across an extended temperature range of -55°C to 150°C. It conforms to RoHS environmental directives and meets AEC-Q101 automotive qualification standards, underscoring its suitability for use in rigorous industrial and automotive environments.
Its low gate charge of 80 nC at Vgs and forward voltage of 900 mV contribute to reducing switching losses and thermal stress, making it a benchmark solution for flyback and similar topology power designs.
This component is surface mount ready for automated manufacturing processes and is suitable for applications in industrial power supplies, automotive electronics, and energy-efficient consumer electronics circuits.
The ThinPAK 5x6 package enables minimal PCB area usage with a height of 1 mm. Low parasitic inductance and optimized layout contribute to excellent thermal and electrical performance. The device includes integrated ESD protection diode for system reliability.
Meets RoHS compliance and AEC-Q101 automotive standards for quality assurance. Supports voltage and current requirements common in industrial power switching. Offers robust operation in wide temperature ranges for diverse applications.
Low gate charge and forward voltage enhance energy efficiency in switching applications. Designed for surface mounting in high-density PCB assemblies.
Explore further products in our Electronics & Electricals > Semiconductor > MOSFET category to find complementary devices and optimize your circuit designs with high-quality components from Infineon and other leading manufacturers.
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