onsemi FDH300ATR is a high-quality silicon junction switching diode designed for electronic component applications requiring efficient switching and rectification. This single diode device is housed in a compact DO-204AH surface-mount package featuring a 2-pin configuration for easy PCB integration.
Engineered to handle a maximum forward current of 500 mA, this diode ensures reliable performance in low to moderate power electronic circuits. It boasts a maximum peak reverse repetitive voltage rating of 125 volts, providing robust protection against voltage surges and spikes common in switching applications.
The FDH300ATR diode exhibits a low forward voltage drop of 1 volt minimizing power dissipation and improving overall circuit efficiency. It can dissipate up to 500 mW of power and endure peak non-repetitive forward surge currents up to 4 amps, suitable for transient overloads.
Operating temperature tolerance extends to 175°C, enabling use in demanding industrial and commercial environments. The device’s physical dimensions, measuring approximately 3.3 mm in length, 1.91 mm in width and height, and 1.5 mm in diameter, allow flexible placement in compact electronic assemblies.
This diode is ideal for multiple industrial and laboratory applications involving switching and rectification tasks, including power supplies, communication devices, and control systems.
This is a single silicon junction switching diode designed for surface mount applications. Maximum forward current is rated at 500 mA to ensure reliable operation in low power circuits. Package type DO-204AH provides durable 2-pin encapsulation with small form factor.
Maximum power dissipation of 500 mW supports moderate heat generation during operation. Maximum reverse repetitive voltage rating of 125 V protects circuits against voltage spikes. Peak non-repetitive forward surge current withstands up to 4 A for transient conditions.
Low forward voltage drop of 1 V reduces power loss and improves efficiency. Device supports maximum operating temperature up to 175°C for robust thermal performance. Compact dimensions of 3.3 mm length, 1.91 mm width and height, and 1.5 mm diameter suit dense PCB layouts.
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