Infineon N-Channel MOSFET TDSON 8-Pin, 381A 40V 0.7mΩ, Surface Mount BSC0

Infineon BSC027N06LS5ATMA1 is a high-current N-channel power MOSFET designed for demanding industrial and electronic applications. Engineered with a TDSON surface-mount package and 8-pin configuration, it delivers outstanding performance for circuits requiring high drain current capability and efficient switching. Its ultra-low Rds(on) of 0.7mΩ, combined with robust thermal endurance, make it particularly suited for compact PCB layouts where conduction losses and thermal management are critical design factors.

This MOSFET provides a maximum continuous drain current of 381A and supports up to 40V drain-source voltage, making it ideal for medium-voltage switching applications such as power supplies, synchronous rectification, and high-current motor drivers. With a power dissipation rating of 81W and gate-source voltage tolerance up to 20V, it handles heavy loads reliably while ensuring rapid switching with its 80nC typical gate charge.

Operating across a wide ambient temperature range from -55°C to 175°C, the BSC027N06LS5ATMA1 is suitable for environments exposed to extreme temperatures. Its forward diode voltage of 1V and automotive standard exclusion further define its applicability toward non-automotive, high-volume industrial designs.

High sustained load capacity with 381A drain current supports demanding power stages. Low Rds(on) ensures minimal heat generation and efficient energy transfer. Package type TDSON with surface-mount enables high-density board designs.

Versatile for applications like battery management systems and DC-DC converter switching stages. RoHS compliance ensures suitability for regulated industrial electronics.

Use cases for Infineon's BSC027N06LS5ATMA1 include industrial drives, power conversion modules, battery management circuits, and compact motor controllers operating across wide temperature ranges. Its robust features guarantee high reliability in laboratory, manufacturing, and commercial electronics. The device's characteristics are specifically tailored for system designers who need both performance and thermal resilience without compromising PCB real estate.

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