Samtec TSM Series Vertical Surface Pin Header 8 Contacts 2.54 mm Pitch 2 Row Unshrouded TSM-104-03-L-DV-A

Samtec TSM-104-03-L-DV-A is a professional-grade vertical surface mount pin header designed for electronic and electrical board interconnections. This 8-contact pin header is arranged over 2 rows with a pitch of 2.54 mm, making it ideal for board-to-board connection applications within industrial, commercial, and electronic manufacturing settings.

The pin header uses a black liquid crystal polymer housing that provides excellent mechanical strength and electrical insulation. Contacts are precision manufactured from phosphor bronze material and plated with gold over nickel plating of 1.27 μm thickness to ensure low contact resistance and high durability.

Rated for 5.4 A current and 475 V voltage, this connector maintains reliable electrical performance across a wide operating temperature range of -55°C to +125°C. The solder termination mount type ensures efficient surface mounting on printed circuit boards for strong mechanical bonds and reliable signal transmission.

This unshrouded vertical pin header is ideally suited for applications in electronic component assembly, power connectors, instrumentation panels, and varied industrial electronic interfaces, providing consistent performance and connection reliability.

This pin header supports a current rating of 5.4 A for reliable electrical performance. Constructed with liquid crystal polymer housing for durable insulation. Phosphor bronze contacts ensure robust mechanical and electrical characteristics.

Contacts are gold plated for maximum conductivity and corrosion resistance. Designed for surface mount solder termination on printed circuit boards. Operates within a temperature range of -55°C to 125°C, suitable for harsh environments.

Offers a voltage rating of 475 V for versatile application use. Unshrouded connector style facilitates easy mating with complementary connectors. RoHS compliant ensuring environmentally friendly manufacturing.

This product is supplied new and meets the industrial standards expected for advanced PCB interconnection solutions. It is a trusted choice for engineers designing compact and high-density circuit board layouts.

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