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Molex C-Grid III Series Right Angle Through Hole PCB Header, 15 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded 90136-2215
Specifications
| Country of Origin | India |
|---|---|
| Voltage | 350V |
| Brand | Molex |
| Orientation | Right Angle |
| Current | 3A |
| Mount Type | Through Hole |
| Housing Material | Polyester |
| Contact Material | Brass |
| Series | C-Grid III |
| Termination Type | Solder |
| Maximum Operating Temperature | 125°C |
| Minimum Operating Temperature | -55°C |
| Number of Rows | 1 |
| Pitch | 2.54mm |
| Contact Plating | Gold |
| Number of Contacts | 15 |
| Contact Gender | Male |
| Shrouded/Unshrouded | Shrouded |
| Connector System | Wire-to-Board |
| Tail Pin Length | 2.9mm |
| Mating Pin Length | 6.75mm |
Key Features
- Features a 15-contact, 1-row configuration suitable for wire-to-board applications.
- Constructed with a shrouded design for enhanced connector protection and alignment.
- Right angle orientation optimizes PCB layout and space utilization.
- Uses a polyester housing and brass contacts plated with gold for durability and conductivity.
- Supports a current rating of 3 A with a voltage rating of 350 V.
- Operates reliably between -55°C and 125°C temperature range.
- Designed for through-hole mounting with solder termination type.
- Tail pin length is 2.9 mm with mating pin length of 6.75 mm for secure connections.
Product Description
Molex 90136-2215 C-Grid III Series Right Angle Through Hole PCB Header is engineered for high-performance wire-to-board connectivity in electronic and industrial applications. Featuring 15 contacts in a single row with a 2.54 mm pitch, this shrouded header ensures robust mechanical and electrical engagement.
Made with a durable polyester housing and brass contacts plated in gold, it offers excellent conductivity and resistance to corrosion. The right-angle orientation maximizes circuit board space efficiency and provides reliable locking with compatible housings.
Rated for 3 Amps current and up to 350 Volts, this PCB Header supports operation in harsh environments with a temperature range from -55°C to 125°C. Its solder termination and through-hole mount type facilitate secure and stable connections on printed circuit boards.
The tail pin length of 2.9 mm and mating pin length of 6.75 mm provide dependable mechanical strength and alignment. Shrouded design enhances contact protection and reduces risk of damage during assembly and operation.
15-contact, 1-row configuration for precise connections. Shrouded header housing for enhanced durability and protection. Right angle mounting optimizes PCB layout space. Polyester housing and gold-plated brass contacts for long-term reliability.
Electrical ratings of 3 A current and 350 V voltage. Wide operating temperature range of -55°C to 125°C. Solder termination and through-hole mount for assembly stability. Tail pin length 2.9 mm and mating pin length 6.75 mm.
This product is ideal for use in industrial electronics, telecommunications equipment, instrumentation, and manufacturing assembly lines requiring dependable electrical connections. Molex’s C-Grid III series offers versatility and mechanical robustness for complex PCB designs.
Explore the wide range of Molex connectors and headers available at EnvMart for reliable solutions in electronics and electrical applications.
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Frequently Asked Questions
The current rating for this PCB header is 3 Amps.
This model has a voltage rating of 350 Volts.
It operates reliably between -55°C and 125°C.
The header features 15 contacts in a single row configuration.
The housing is made of polyester, and the contacts are brass plated with gold.
This model is designed for through-hole mounting with solder termination.
The pitch size of the contacts is 2.54 mm.
The tail pin length is 2.9 mm.
The mating pin length is 6.75 mm.
This header is shrouded, which enhances contact protection and alignment.
It is suitable for wire-to-board applications in industrial electronics, telecommunications equipment, and instrumentation.
The orientation of this header is right angle, optimizing PCB layout and space utilization.
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