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Infineon Isolated HEXFET 2 Type P-Channel MOSFET, 2.3 A, 20 V Enhancement, 8-Pin SOIC IRF7104TRPBF

Category MOSFET Brand Infineon Condition New

Specifications

Country of Origin China
Brand Infineon
Height 1.5mm
Length 5mm
Model IRF7104TRPBF
Width 4mm
Mount Type Surface
Series HEXFET
Maximum Operating Temperature 150°C
Package Type SOIC
Minimum Operating Temperature -55°C
Pin Count 8
Number of Elements per Chip 2
Channel Type Type P
Maximum Continuous Drain Current Id 2.3A
Maximum Drain Source Voltage Vds 20V
Maximum Drain Source Resistance Rds 400mΩ
Channel Mode Enhancement
Maximum Power Dissipation Pd 2W
Typical Gate Charge Qg @ Vgs 9.3nC
Maximum Gate Source Voltage Vgs -12, +12V
Forward Voltage Vf -1.2V
Transistor Configuration Isolated

Key Features

  • This MOSFET uses isolated HEXFET technology ensuring low conduction losses.
  • Features an enhancement channel mode perfect for switching applications.
  • Compact surface-mount SOIC package measuring 5 mm length, 4 mm width, and 1.5 mm height.
  • Capable of operating from -55°C to a maximum temperature of 150°C for reliable performance.
  • Maximum power dissipation of 2 W supports efficient heat handling.
  • Typical gate charge of 9.3 nC at Vgs for fast switching.
  • Maximum gate-source voltage rating of ±12 V protects gate oxide integrity.
  • Designed with 2 elements per chip to enhance robustness.

Product Description

Infineon IRF7104TRPBF is a high-performance isolated HEXFET P-Channel MOSFET designed to deliver reliable switching performance with a maximum continuous drain current of 2.3 A and a drain-source voltage rating of 20 V. Packaged in a compact and durable 8-pin SOIC surface-mount format, this device suits applications requiring efficient power management in tight PCB layouts.

Utilizing enhancement mode channel operation, the transistor provides excellent control characteristics and low on-resistance of 400 mΩ, reducing conduction losses and improving system efficiency. Its robust thermal specifications, operating from -55°C up to 150°C with a power dissipation capacity of 2 W, make it suitable for industrial and commercial electronics requiring reliable thermal endurance.

The device features a minimal gate charge of 9.3 nC at gate voltage, facilitating fast switching speeds and enhancing overall power efficiency. It supports a gate-source voltage range of -12 V to +12 V to protect the MOSFET during driving conditions. The isolated transistor configuration includes 2 elements per chip for improved performance in isolated or float applications.

Incorporating forward voltage characteristics of -1.2 V, this MOSFET is ideal for applications such as power management in consumer electronics, industrial control systems, and embedded circuit designs requiring P-channel switching. Manufactured in China with Infineon’s quality standards, it offers consistent reliability.

This product is suited for use in semiconductor assemblies, discrete semiconductor applications, and electronic device manufacturing. It provides designers with a compact, efficient semiconductor switch component conforming to typical surface mount assembly processes.

Isolated HEXFET technology reduces conduction losses for efficiency. P-Channel enhancement mode MOSFET for versatile switching applications. Compact 8-pin SOIC package ideal for surface mount PCB design. Wide operating temperature range from -55°C to 150°C.

Low on-resistance and minimal gate charge for high efficiency. Maximum power dissipation of 2 W supports thermal robustness. Gate-source voltage limits of ±12 V ensure gate protection. Two elements per chip for enhanced transistor reliability.

Manufactured in China adhering to Infineon production standards. Suitable for industrial, electronic manufacturing and embedded system applications. Explore more semiconductor and MOSFET products from Infineon through EnvMart’s electronics components category for precision and quality.

Infineon Isolated HEXFET 2 Type P-Channel MOSFET, 2.3 A, 20 V Enhancement, 8-Pin SOIC IRF7104TRPBF
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Frequently Asked Questions

The maximum continuous drain current for this model is 2.3 A.

It has a maximum drain-source voltage rating of 20 V.

The typical gate charge at Vgs is 9.3 nC, facilitating fast switching speeds.

The package dimensions are 5 mm in length, 4 mm in width, and 1.5 mm in height.

It operates within a temperature range of -55°C to 150°C.

The maximum power dissipation capacity is 2 W, supporting efficient heat handling.

The maximum gate-source voltage rating is ±12 V, which protects the gate oxide integrity.

This MOSFET features 2 elements per chip to enhance robustness.

It uses an enhancement mode P-channel configuration for versatile switching applications.

The maximum drain-source resistance is 400 mΩ, which helps reduce conduction losses.

This model is suitable for power management in consumer electronics, industrial control systems, and embedded circuit designs.

It is manufactured in China according to Infineon’s quality standards.

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