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| Country of Origin | Thailand |
|---|---|
| Brand | Infineon |
| Height | 1.3mm |
| Length | 3mm |
| Model | IRLMS2002TRPBF |
| Width | 1.75mm |
| Mount Type | Surface |
| Series | HEXFET |
| Maximum Operating Temperature | 150°C |
| Package Type | Micro6 |
| Minimum Operating Temperature | -55°C |
| Pin Count | 6 |
| Channel Type | N |
| Maximum Continuous Drain Current Id | 6.5A |
| Maximum Drain Source Voltage Vds | 20V |
| Maximum Drain Source Resistance Rds | 45mΩ |
| Channel Mode | Enhancement |
| Maximum Power Dissipation Pd | 2W |
| Typical Gate Charge Qg @ Vgs | 15nC |
| Maximum Gate Source Voltage Vgs | -12, +12V |
| Forward Voltage Vf | 1.2V |
Infineon's IRLMS2002TRPBF HEXFET N-Channel MOSFET is engineered for robust performance in power management applications requiring efficient switching and thermal stability. The device features a continuous drain current rating of 6.5 A and a maximum drain-source voltage of 20 V, packaged in a compact 6-pin Micro6 surface mount form factor that optimizes PCB space.
Designed with enhancement-mode operation, it supports gate-to-source voltages up to ±12 V, enabling flexible and precise control in electronic circuits. Its low typical drain-source resistance of 45 mΩ minimizes conduction losses, thereby improving overall circuit efficiency. The device dissipates up to 2 W of power with a maximum junction temperature of 150°C, making it suitable for demanding industrial and automotive environments.
Its compact dimensions of 3 mm length, 1.75 mm width, and 1.3 mm height allow integration into dense circuit layouts. The MOSFET features a typical gate charge of 15 nC at Vgs, enhancing its switching speed and efficiency for high-frequency applications.
This MOSFET is ideal for battery management and load control systems, high-efficiency power supplies, and renewable energy systems requiring reliable power handling and thermal management. The maximum junction-to-ambient thermal resistance is 62.5°C/W, ensuring effective heat dissipation during operation. A linear thermal derating factor of 0.016 W/°C needs consideration to maintain device reliability at elevated temperatures.
Low on-resistance enhances power efficiency. Continuous drain current capability of up to 6.5 A. Supports ±12 V gate-to-source voltage for flexible control. Efficient power dissipation rated at 2 W. Compact 6-pin Micro6 surface mount package.
Operating temperature range from -55°C to 150°C. Typical gate charge of 15 nC at Vgs for fast switching. Maximum drain-source resistance of 45 mΩ. Designed for automotive and industrial power management. Manufactured in Thailand with HEXFET technology.
This MOSFET series from Infineon is well-suited for industrial, automotive, electrical, and renewable energy applications that demand reliable and efficient power semiconductor devices. Explore more MOSFETs and power components in the Electronics & Electricals category at EnvMart.
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