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Infineon HEXFET Type P-Channel MOSFET, 55 V, 18 A, 57 W Power Dissipation, 3-Pin TO-252 IRFR5505TRPBF

Category MOSFET Brand Infineon Condition New

Specifications

Country of Origin India
Brand Infineon
Height 2.39mm
Length 6.73mm
Model IRFR5505TRPBF
Width 6.22mm
Mount Type Surface
Series HEXFET
Maximum Operating Temperature 150°C
Package Type TO-252
Minimum Operating Temperature -55°C
Pin Count 3
Channel Type Type P
Maximum Continuous Drain Current Id 18A
Maximum Drain Source Voltage Vds 55V
Maximum Drain Source Resistance Rds 110mΩ
Channel Mode Enhancement
Maximum Power Dissipation Pd 57W
Typical Gate Charge Qg @ Vgs 32nC
Maximum Gate Source Voltage Vgs -20, +20V
Forward Voltage Vf -1.6V

Key Features

  • This HEXFET device operates in enhancement mode and features low drain-source on-resistance of 110 milliohms.
  • The MOSFET supports maximum operating temperatures up to 150°C and a gate-source voltage range of -20 V to +20 V.
  • Typical gate charge is 32 nC at 10 V gate drive, enabling efficient switching performance.
  • The device dimensions measure 6.73 mm length, 6.22 mm width, and 2.39 mm height suitable for compact PCB layouts.
  • It is designed for surface mount technology to optimize thermal management and assembly efficiency.

Product Description

Infineon's IRFR5505TRPBF is a HEXFET Type P-Channel MOSFET engineered for efficient power switching applications requiring up to 18 A continuous current and 55 V drain-source voltage. Packaged in a compact 3-pin TO-252 surface mount format, it combines high power dissipation capability of 57 W with robust thermal performance.

This device operates in enhancement mode with a low maximum drain-source resistance of 110 milliohms, minimizing conduction losses and improving overall system efficiency. The maximum operating junction temperature reaches 150°C, supporting reliable operation in demanding environments.

The typical gate charge of 32 nC at a gate-source voltage of 10 V ensures fast switching characteristics suitable for various power management designs. Its gate-source voltage rating of -20 V to +20 V provides ample margin for standard circuits.

With physical dimensions of 6.73 mm in length, 6.22 mm width, and a height of 2.39 mm, the MOSFET fits well in compact layouts while enabling effective heat dissipation through surface mounting.

Infineon's HEXFET MOSFETs are widely used in industrial power electronics, automotive electronics (though this specific model is not automotive-standard qualified), commercial devices, and general electrical circuits requiring precise and efficient power control.

This HEXFET device operates in enhancement mode and features low drain-source on-resistance of 110 milliohms. The MOSFET supports maximum operating temperatures up to 150°C and a gate-source voltage range of -20 V to +20 V.

Typical gate charge is 32 nC at 10 V gate drive, enabling efficient switching performance. The device dimensions measure 6.73 mm length, 6.22 mm width, and 2.39 mm height suitable for compact PCB layouts. It is designed for surface mount technology to optimize thermal management and assembly efficiency.

Explore the Infineon MOSFET category at EnvMart for more power semiconductor solutions tailored to your design requirements.

Infineon HEXFET Type P-Channel MOSFET, 55 V, 18 A, 57 W Power Dissipation, 3-Pin TO-252 IRFR5505TRPBF
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Frequently Asked Questions

The maximum continuous drain current for this model is 18 A.

This MOSFET has a maximum drain-source voltage rating of 55 V.

It can dissipate a maximum power of 57 W.

The dimensions are 6.73 mm in length, 6.22 mm in width, and 2.39 mm in height.

The gate-source voltage range is from -20 V to +20 V.

The typical gate charge at a 10 V gate drive is 32 nC.

It is designed for surface mount technology.

The maximum operating temperature is 150°C.

This model features a Type P channel.

The maximum drain-source on-resistance is 110 milliohms.

The minimum operating temperature is -55°C.

This device is manufactured in India.

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