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| Country of Origin | India |
|---|---|
| Brand | Infineon |
| Height | 1.5mm |
| Length | 5mm |
| Model | IRF7832TRPBF |
| Width | 4mm |
| Mount Type | Surface |
| Series | HEXFET |
| Maximum Operating Temperature | 155°C |
| Package Type | SOIC |
| Minimum Operating Temperature | -55°C |
| Pin Count | 8 |
| Channel Type | N |
| Maximum Continuous Drain Current Id | 20A |
| Maximum Drain Source Voltage Vds | 30V |
| Maximum Drain Source Resistance Rds | 4.8mΩ |
| Channel Mode | Enhancement |
| Maximum Power Dissipation Pd | 2.5W |
| Typical Gate Charge Qg @ Vgs | 34nC |
| Maximum Gate Source Voltage Vgs | -20, +20V |
| Forward Voltage Vf | 1V |
Infineon IRF7832TRPBF is a HEXFET N-Channel Enhancement Mode MOSFET engineered for robust power switching and control in compact electronic and industrial systems. This surface-mount component offers a balance of high continuous drain current capability and manageable thermal power dissipation, making it ideal for medium power designs integrating modern boards with standard SOIC footprints.
With a maximum continuous drain current of 20 A and a drain-source voltage rating of 30 V, this MOSFET is suited for low-voltage power rail applications including DC-DC converter switching stages and motor driver power switches. Its low on-resistance of 4.8 mΩ results in reduced conduction losses enhancing efficiency in power-sensitive designs.
The device's typical gate charge of 34 nC supports faster switching transitions, improving dynamic performance, while its maximum power dissipation of 2.5 W ensures sustained thermal reliability under typical operating conditions. The ±20 V gate-source voltage tolerance provides design flexibility for various drive circuit configurations.
Operating from -55 °C up to 155 °C, the IRF7832TRPBF withstands harsh industrial temperatures, suitable for demanding environments. The 8-pin SOIC package facilitates easy assembly on PCBs with standard footprints and enhances thermal spreading for device longevity.
Applications include synchronized rectification in power supplies, load switching in telecommunications, battery management systems, and motor control circuits in industrial automation. Its forward voltage of 1 V must be considered in designs involving body diode conduction or reverse recovery scenarios to ensure optimal performance.
The device supports a maximum drain current of 20 amps for high-current loads. Low on-resistance of 4.8 milliohms enables efficient conduction and reduced losses. Operates with a maximum drain-source voltage of 30 volts suitable for low-voltage power rails.
Typical gate charge is 34 nanocoulombs supporting faster switching performance. Maximum power dissipation is 2.5 watts ensuring reliable thermal management. Gate-source voltage tolerance ranges from -20 volts to +20 volts for flexible drive conditions.
Functions over a wide temperature range from -55°C to 155°C for industrial use. Compact 8-pin SOIC surface-mount package supports standard PCB footprint and thermal spreading. Forward voltage of 1 volt influences conduction characteristics during switching operations.
For applications requiring reliable power switching in compact electronic systems, Infineon's IRF7832TRPBF combines performance and durability, making it a top choice for semiconductor discrete component selections. Explore more Infineon semiconductor products and harness powerful solutions for your electronics designs with EnvMart.
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