onsemi 200 V 200 mA Small Signal Diode Through Hole DO-35 Package 2-Pin 1N485BTR

The onsemi 1N485BTR Small Signal Diode is a robust and reliable semiconductor component optimized for switching and signal rectification in electronic circuits. It features a compact DO-35 package with through-hole mounting suitable for diverse industrial and commercial electronics designs.

With a maximum continuous forward current of 200 mA and a peak reverse repetitive voltage of 200 V, this diode effectively manages small signal applications requiring precise control and stable performance. The low forward voltage drop of 1 V ensures minimal power loss during operation, improving overall circuit efficiency.

The device's peak non-repetitive forward surge current of 4 A supports transient conditions, making it suitable for protection circuits and signal conditioning. Its operational temperature rating of 175°C allows deployment in environments subjected to elevated temperatures, suitable for industrial, manufacturing, and automotive electronics that demand durability.

Physically, the diode measures 1.91 mm in length and diameter, with a 4.56 mm height, making it compact enough for densely packed circuit boards without compromising mechanical stability.

The diode features a maximum continuous forward current of 200 mA. It has a peak reverse repetitive voltage rating of 200 V. The package type is DO-35 with a through-hole mount style. The device has a single diode configuration with 2 pins.

Its maximum forward voltage drop is 1 V for efficient conduction. Peak non-repetitive forward surge current is rated at 4 A. Operating temperature can reach up to 175°C, ensuring reliability in demanding environments. Physical dimensions include a length of 1.91 mm, diameter of 1.91 mm, and height of 4.56 mm.

The diode does not conform to automotive standards or special approvals.

This small signal diode is ideal for industrial electronics, consumer devices, instrumentation, and other applications requiring reliable switching and rectifier components with compact form factor and excellent thermal characteristics.

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