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| Country of Origin | India |
|---|---|
| Brand | Samtec |
| Orientation | Straight |
| Current | 2.5A |
| Model | TOLC-110-02-S-Q |
| Mount Type | Surface |
| Housing Material | Liquid Crystal Polymer |
| Contact Material | Phosphor Bronze |
| Series | TOLC |
| Termination Type | Solder |
| Maximum Operating Temperature | 125°C |
| Minimum Operating Temperature | -55°C |
| Number of Rows | 4 |
| Pitch | 1.27mm |
| Contact Plating | Gold |
| Number of Contacts | 40 |
| Contact Gender | Male |
| Shrouded/Unshrouded | Shrouded |
| Connector System | Board-to-Board |
Samtec TOLC-110-02-S-Q is a high-performance PCB Header designed for board-to-board connector applications in electronics manufacturing. This straight, shrouded SMT terminal strip offers a staggered quad row configuration with 40 contacts and a 1.27 mm pitch, providing reliable electrical connections in a compact form factor.
The connector housing is made from liquid crystal polymer, known for its durability and thermal resistance, supporting operating temperatures from -55°C up to 125°C. Contacts are phosphor bronze plated with 0.75 μm gold on the mating surfaces and 0.075 μm gold on contact tails to ensure excellent conductivity and solder joint reliability.
The row pitch is precisely maintained at 1.27 mm with a 0.635 mm offset between contact rows, optimizing the pin density without compromising mechanical stability. This TOLC series connector is surface mounted and male gender, suitable for integration with SOLC series high-density socket counterparts.
The connector features a staggered quad row design with four rows. Contacts made of phosphor bronze with gold plating for durability and conductivity. Housing constructed of liquid crystal polymer for thermal and mechanical stability.
Operating temperature range from -55°C to 125°C ensures robust performance in diverse environments. Mount type is surface mount for efficient PCB assembly. Shrouded design protects contacts and ensures secure mating. Compatible with SOLC high-density socket strips for board-to-board applications.
Maintains a 1.27 mm pitch and 0.635 mm offset between rows for high contact density.
This product is ideal for use in electronics, electrical connectors, and PCB assembly within industrial manufacturing, telecommunications, computing hardware, and other high-density connector applications.
Explore the full range of Samtec connectors at EnvMart to find robust solutions for your PCB interconnection needs.
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