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RS PRO Lead Solder Wire 0.71 mm Diameter 60/40 Tin/Lead Alloy Rosin Based Flux 183°C Melting Point 500g 756-8900

Category Solder Wire Brand RS PRO Condition New

Specifications

Country of Origin India
Brand RS PRO
Model 756-8900
Melting Point 183°C
Product Weight 500g
Wire Diameter 0.71mm
Product Form Wire
Percent Lead 40%
Percent Tin 60%
Flux Type Rosin Based
Stannol Wire, 0.7mm Lead solder, 183°C Melting PointBrand Stannol
Multicore Wire, 0.7 mm Lead Solder, 188 °C Melting PointBrand Multicore
MBO Wire, 0.7 mm Lead Solder, 183 °C Melting PointBrand MBO
RS PRO Wire, 0.71 mm Lead Solder, 183 °C Melting PointBrand RS PRO

Key Features

  • Composed of 60% tin and 40% lead alloy delivering superior wetting properties.
  • Contains a rosin based flux providing clear, no-clean residue.
  • Wire diameter is precisely 0.71 mm for fine soldering tasks.
  • Melts at 183°C, enabling efficient heat application without damage.
  • Product weight is 500 grams, suitable for extended soldering projects.
  • Ideal for securing electrical components on PCBs and integrated circuits.
  • Suits applications involving SMD and through-hole components.
  • Quick cooling property facilitates fast setting and reworking.

Product Description

RS PRO 756-8900 Lead Solder Wire is a high quality 0.71 mm diameter wire made from a 60/40 tin/lead alloy blend with rosin based flux and a melting point of 183°C. Designed for reliable soldering tasks, this solder wire offers superior wetting and clear no-clean flux residue, making it ideal for use in electronics assembly, repair, prototyping, and manufacturing.

The wire’s diameter ensures precise application suitable for both surface mount devices (SMD) and through-hole components. Its relatively low melting point of 183°C reduces the risk of heat damage to sensitive electronic components and circuit boards during soldering. The 500 gram spool provides ample material for extensive soldering projects.

This leaded solder wire is formulated with a synthetically refined resin and an effective activator package, resulting in consistent fluxing action and excellent adhesion to all printed circuit board (PCB) finishes. The resin base yields a clear, no-clean flux residue that does not require additional cleaning steps after soldering, enhancing work efficiency.

Soldering with this wire is suitable for industrial, electronics manufacturing, laboratory, and repair use. The solder quickly melts and solidifies, allowing straightforward component attachment and easy reworking with solder suckers if necessary.

While leaded solder is restricted in some applications due to environmental and safety regulations, it offers advantages such as a lower melting point and stable shelf life compared to lead-free alternatives. This makes RS PRO 756-8900 a reliable choice for hand soldering and projects requiring precise thermal control.

Composed of 60% tin and 40% lead alloy delivering superior wetting properties. Contains a rosin based flux providing clear, no-clean residue. Wire diameter is precisely 0.71 mm for fine soldering tasks. Melts at 183°C, enabling efficient heat application without damage.

Product weight is 500 grams, suitable for extended soldering projects. Ideal for securing electrical components on PCBs and integrated circuits. Suits applications involving SMD and through-hole components. Quick cooling property facilitates fast setting and reworking.

Resin based Solder Wire formulated with a synthetically refined resin. Effective activator package ensures reliable solder joints in industrial use. Browse EnvMart’s extensive catalog of soldering wires and supplies to find complementary tools and materials to enhance your electronics manufacturing and repair workflow.

RS PRO Lead Solder Wire 0.71 mm Diameter 60/40 Tin/Lead Alloy Rosin Based Flux 183°C Melting Point 500g 756-8900
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Frequently Asked Questions

The solder wire has a melting point of 183°C, which allows for efficient heat application without damaging sensitive components.

This model features a wire diameter of 0.71 mm, making it suitable for fine soldering tasks.

It is composed of 60% tin and 40% lead alloy, providing superior wetting properties for reliable solder joints.

The solder wire contains a rosin-based flux that leaves a clear, no-clean residue after soldering, eliminating the need for additional cleaning steps.

The product weighs 500 grams, which is suitable for extended soldering projects.

This solder wire is ideal for securing electrical components on PCBs and integrated circuits, and it suits applications involving SMD and through-hole components.

It has a quick cooling property that facilitates fast setting and reworking, allowing for straightforward component attachment.

The solder wire is manufactured in India.

Yes, the solder wire's diameter and composition make it suitable for both surface mount devices (SMD) and through-hole components.

The solder wire is formulated with a synthetically refined resin and an effective activator package, which ensures reliable solder joints in industrial use.

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