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RS PRO Lead Free Solder Wire 0.38 mm Diameter, Rosin Based Flux, 228°C Melting Point 756-8887
Specifications
| Country of Origin | United States |
|---|---|
| Brand | RS PRO |
| Model | 756-8887 |
| Melting Point | 228°C |
| Product Weight | 250g |
| Wire Diameter | 0.38mm |
| Standards/Approvals | RoHS, J-STD 004 |
| Product Form | Wire |
| Percent Lead | 0% |
| Percent Tin | 99.5% |
| Flux Type | Rosin Based |
| Percent Copper | 0.5% |
| Multicore Wire, 0.5mm Lead Free Solder, 227°C Melting PointBrand | Multicore |
Key Features
- The solder wire contains 0% lead for safer and environmentally friendly use.
- Rosin based flux ensures excellent wetting and bright, reliable solder joints.
- Composed primarily of 99.5% tin and 0.5% copper for strong mechanical properties.
- Suitable for repair, prototyping, and production in electronic assembly and soldering tasks.
- Resin based alloy prolongs the life of soldering iron tips during continuous use.
- Meets RoHS and J-STD-004 standards for compliance and quality assurance.
- Designed for use with SMD and through-hole components requiring narrow pitch soldering.
Product Description
RS PRO 756-8887 lead free solder wire features a 0.38 mm diameter and a melting point of 228°C, making it highly suitable for precise soldering of electronic components. Its rosin based flux formulation facilitates good spread and wetting, delivering bright and robust solder joints for various applications.
Containing 99.5% tin and 0.5% copper, this solder wire is free of lead, providing a safer alternative for electronic assembly and repair work. The resin based alloy composition also extends the lifespan of soldering iron tips by minimizing tip wear during soldering operations.
This solder wire is widely used in industrial, manufacturing, electronics repair, and prototyping environments requiring high-quality, RoHS compliant materials. It conforms to the J-STD-004 standard for flux classification, ensuring reliable solder joint formation across different applications.
Common applications include soldering of both Surface Mount Devices (SMD) and through-hole components on printed circuit boards where narrow pitch and precise solder deposition are critical. Its relatively low melting point allows for easy rework and minimal thermal stress on components and substrate materials.
The product is manufactured in the United States, ensuring consistent quality and performance for professional and laboratory uses. The Solder Wire enables efficient and neat solder joints with minimum oxidation. The rosin flux is suitable for a wide range of soldering tasks, offering good reliability.
Lead free composition supports environmental and safety compliance in electronics manufacturing. Ideal for use in electronics assembly, prototyping, and field repair applications. Compatibility with industry standards like RoHS and J-STD-004 ensure broad acceptance and quality assurance.
Explore EnvMart for wider selections of soldering wires and electronics tools to suit various industrial and laboratory requirements.
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Frequently Asked Questions
The solder wire has a diameter of 0.38 mm.
It has a melting point of 228°C, making it suitable for precise soldering tasks.
The solder wire is composed of 99.5% tin and 0.5% copper, ensuring strong mechanical properties.
It uses a rosin based flux, which ensures excellent wetting and reliable solder joints.
Yes, this solder wire contains 0% lead, making it safer and more environmentally friendly.
It meets RoHS and J-STD-004 standards for compliance and quality assurance.
The product weighs 250g.
It is suitable for electronic assembly, prototyping, and repair tasks, particularly with SMD and through-hole components.
This solder wire is manufactured in the United States.
The rosin based flux formulation facilitates good spread and wetting, resulting in bright and robust solder joints.
The resin based alloy composition prolongs the life of soldering iron tips by minimizing tip wear during use.
It is designed for use with both Surface Mount Devices (SMD) and through-hole components requiring narrow pitch soldering.
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