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Molex Micro-Fit 3.0 Series Right Angle Surface PCB Header 12 Contacts 3 mm Pitch 2 Row Shrouded 43045-1209
Specifications
| Country of Origin | India |
|---|---|
| Voltage | 250V |
| Brand | Molex |
| Orientation | Right Angle |
| Current | 5A |
| Mount Type | Surface |
| Housing Material | Thermoplastic |
| Contact Material | Brass |
| Series | Micro-Fit 3.0 |
| Termination Type | Solder |
| Maximum Operating Temperature | 125°C |
| Minimum Operating Temperature | -40°C |
| Number of Rows | 2 |
| Pitch | 3mm |
| Contact Plating | Tin |
| Number of Contacts | 12 |
| Contact Gender | Male |
| Shrouded/Unshrouded | Shrouded |
| Connector System | Wire-to-Board |
| Mating Pin Length | 3mm |
Key Features
- Features a shrouded two-row design for secure and reliable mating.
- Supports up to 5A current capacity for efficient power distribution.
- Manufactured with thermoplastic housing and brass contacts plated with tin.
- Designed for surface mount technology with solder termination and 3mm mating pin length.
- Operates reliably between -40°C and 125°C for diverse industrial applications.
- Employs positive latching to prevent accidental disconnection.
- Housings resist high temperatures during IR reflow soldering processes.
- Suitable for wire-to-board connector system in compact electronic assemblies.
Product Description
Molex 43045-1209 Micro-Fit 3.0 Series Right Angle Surface PCB Header is designed for compact power connector applications requiring a reliable wire-to-board connection. It features a 12-contact dual-row configuration with 3 mm pitch, accommodating current loads up to 5A. The right-angle orientation and shrouded housing provide secure mating and protect against accidental disengagement using positive latching mechanisms.
The connector’s thermoplastic housing is engineered to withstand high temperatures up to 265°C during IR reflow soldering, ensuring durability and performance in manufacturing environments. Brass contacts with tin plating afford excellent electrical conductivity and corrosion resistance. Solder tabs secure a robust attachment to PCB surfaces, enhancing mechanical stability.
Operating temperature ranges from -40°C to 125°C enable use in harsh industrial, telecommunications, medical, and consumer electronic equipment including routers, servers, gaming terminals, and household appliances.
This Micro-Fit 3.0 Series header supports a wire-to-board connector system in space-constrained designs that require compact yet high current-carrying capacity solutions. The fully isolated dual beam terminals minimize arcing and maintain excellent electrical performance under operating stress.
High current carrying capacity for compact footprint designs. High temperature resistant UL 94V-0 liquid crystal polymer housing. Positive latching mechanism for secure connections. Fully isolated dual beam terminals enhance reliability.
Solder tabs provide secure PCB attachment.
This product fits applications in industrial, telecommunications, medical, consumer electronics, and solar power sectors, offering robust power connector performance in compact assemblies.
Explore more advanced PCB header connectors in the Connectors category to find suitable solutions for diverse electrical and industrial design requirements.
Explore more products in our PCB Headers category.
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Frequently Asked Questions
It supports a current capacity of up to 5A, making it suitable for efficient power distribution in various applications.
This model features solder termination, which provides a robust attachment to PCB surfaces.
It has a total of 12 contacts arranged in a dual-row configuration.
The housing is made of thermoplastic, while the contacts are brass plated with tin, ensuring good electrical conductivity and resistance to corrosion.
The pitch size is 3 mm, which is standard for many compact connector applications.
It supports a wire-to-board connector system, ideal for compact electronic assemblies.
Yes, it employs a positive latching mechanism that helps prevent accidental disconnection during use.
This model has a right-angle orientation, which is beneficial for space-constrained designs.
The housing can withstand high temperatures up to 265°C during IR reflow soldering processes.
The country of origin for this PCB header is India.
It is suitable for use in industrial, telecommunications, medical, consumer electronics, and solar power applications.
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