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| Country of Origin | India |
|---|---|
| Voltage | 250V |
| Brand | Molex |
| Orientation | Right Angle |
| Current | 5A |
| Mount Type | Through Hole |
| Housing Material | High Temperature Thermoplastic |
| Contact Material | Brass |
| Series | Micro-Fit 3.0 |
| Termination Type | Solder |
| Maximum Operating Temperature | 125°C |
| Minimum Operating Temperature | -40°C |
| Number of Rows | 2 |
| Pitch | 3mm |
| Contact Plating | Gold |
| Number of Contacts | 4 |
| Contact Gender | Male |
| Shrouded/Unshrouded | Shrouded |
| Connector System | Wire-to-Board |
| Mating Pin Length | 3mm |
Molex 43045-0422 Micro-Fit 3.0 Series Right Angle Through Hole PCB Header is a compact, dual-row PCB connector designed for power and signal distribution in electronic assemblies. The 4-contact header with 3 mm pitch offers a low to mid-range power solution supporting up to 5A current and 250V voltage, suitable for demanding industrial and commercial applications.
The right angle orientation and shrouded housing made of high temperature UL 94V-0 rated thermoplastic enable secure and durable mating connections during reflow soldering processes. The connector features gold-plated brass contacts for enhanced conductivity and corrosion resistance, ensuring reliable electrical performance.
This through hole PCB header mounts securely with solder termination and incorporates metal press-fit retention clips to reduce assembly costs and improve attachment strength. Its positive latching housing prevents accidental disconnections, providing stable operation in industrial, consumer, telecommunications, medical, and data communication equipment.
Operating over a wide temperature range from -40°C to 125°C, the Micro-Fit 3.0 Series header is ideal for use in solar power, military commercial off-the-shelf (COTS), gaming terminals, appliances such as dryers and refrigerators, routers, and server systems. The fully isolated dual beam terminals minimize arcing and improve safety in power applications.
This Micro-Fit 3.0 PCB header contains 4 contacts configured in 2 rows with 3 mm pitch spacing. Its high current carrying capacity and compact footprint make it suitable for multiple low to mid power electronic applications.
The connector system is wire-to-board type with male contact gender and solder termination. The header's high temperature housings allow IR reflow soldering compatibility, enhancing manufacturing efficiency. Contact plating with gold and housing latching features ensure reliable electrical and mechanical connectivity over time.
The product complies with Glow Wire standards, ensuring safe operation under high temperature conditions.
Explore the Molex Micro-Fit 3.0 Series collection for high-quality PCB Headers suitable for industrial, construction, laboratory, telecommunications, HVAC, manufacturing, and commercial projects at EnvMart.
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