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Texas Instruments Transmitter IC 4 Drivers TTL CMOS LVDS 400Mbps 16-Pin SOIC DS90LV031ATM/NOPB
Specifications
| Country of Origin | India |
|---|---|
| Brand | Texas Instruments |
| Height | 1.45mm |
| Length | 9.91mm |
| Model | DS90LV031ATM/NOPB |
| Mount Type | Surface |
| Output type | LVDS |
| Series | DS90LV031 |
| Input Type | TTL, CMOS |
| Maximum Operating Temperature | 85°C |
| Package Type | SOIC |
| Sub Type | Transmitter |
| Minimum Operating Temperature | -40°C |
| Pin Count | 16 |
| Number of Elements per Chip | 4 |
| Maximum Supply Voltage | 3.6V |
| Minimum Supply Voltage | 3V |
| Number of Drivers | 4 |
| Number of Receivers | 4 |
| Transmission Data Rate | 400Mbps |
Key Features
- This device integrates 4 differential line drivers and 4 receivers on a single chip.
- Operating supply voltage ranges from 3V minimum to 3.6V maximum.
- Designed for surface-mount applications with a compact SOIC package and 16 pins.
- Supports data transmission rates up to 400Mbps for high speed LVDS communication.
- Operating temperature ranges from -40°C to 85°C ensuring reliability in various environments.
- Includes ESD protection to safeguard against electrostatic discharge damage.
- Offers differential line drivers tailored for LVDS communication applications like Firewire, SATA, and SCSI interfaces.
- The compact height of 1.45mm and length of 9.91mm allows space-efficient PCB designs.
Product Description
Texas Instruments DS90LV031ATM/NOPB is a high-performance LVDS transmitter integrated circuit designed for high-speed differential signal transmission.
Featuring 4 TTL and CMOS compatible input drivers with LVDS output, this interface IC is suited for industrial and commercial applications including data communication interfaces such as Firewire, SATA, and SCSI.
The device operates within a supply voltage range of 3V to 3.6V and can sustain operating temperatures from -40°C to 85°C, making it suitable for a wide range of environmental conditions.
It comes in a 16-pin SOIC surface-mount package that has a compact height of 1.45mm and a length of 9.91mm, providing an efficient footprint for PCB mounting. Its integrated electrostatic discharge (ESD) protection enhances robustness and longevity in electronic systems.
This IC features 4 integrated differential line drivers and 4 receivers per chip. Supports data transmission rates of 400Mbps for reliable and fast communication. Designed for low-voltage differential signaling (LVDS) output supporting improved signal integrity over twisted-pair cables.
Ideal for use in electronic equipment requiring fast interfacing and communication such as industrial automation, computing, and data storage devices. Facilitates efficient and precise signal transmission for high-speed applications.
Compact SOIC package allows for easy integration within dense PCB layouts. Durable operation across extended temperature ranges ensures industrial-grade reliability.
Choose this Texas Instruments DS90LV031ATM/NOPB LVDS transmitter IC for enhanced digital signal transmission performance in demanding industrial, laboratory, and commercial applications.
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Frequently Asked Questions
The maximum data transmission rate of the DS90LV031ATM/NOPB is 400Mbps, enabling high-speed LVDS communication.
This model operates within a supply voltage range of 3V to 3.6V.
The dimensions of the SOIC package are 1.45mm in height and 9.91mm in length.
The DS90LV031ATM/NOPB contains 4 differential line drivers and 4 receivers integrated on a single chip.
It operates within a temperature range of -40°C to 85°C, making it suitable for various environmental conditions.
The device is compatible with TTL and CMOS input types.
This model provides LVDS output, which is designed for low-voltage differential signaling.
Yes, the DS90LV031ATM/NOPB includes electrostatic discharge (ESD) protection to safeguard against damage.
This model is designed for surface-mount applications.
It is suitable for high-speed communication applications such as Firewire, SATA, and SCSI interfaces.
The country of origin for the DS90LV031ATM/NOPB is India.
There are 4 elements integrated per chip in this model.
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