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Infineon Single IGBT Module 1600 A 3300 V TRENCHSTOP™ IGBT4 with Emitter Controlled Diode AG-IHVB130 FZ1600R33HE4BPSA1

Category IGBT Module Brand Infineon Condition New

Specifications

Country of Origin India
Brand Infineon
Height 16.4mm
Length 109.9mm
Model FZ1600R33HE4BPSA1
Configuration Single
Maximum Operating Temperature 150°C
Package Type AG-IHVB130
Minimum Operating Temperature -40°C
Standards/Approvals IEC 60747, 60749 and 60068
Maximum Continuous Collector Current Ic 1600A
Maximum Collector Emitter Voltage Vceo 3300V
Maximum Collector Emitter Saturation Voltage VceSAT 3.25V
Maximum Power Dissipation Pd 3600kW
Maximum Gate Emitter Voltage VGEO 20 V
Number of Transistors 2

Key Features

  • This single switch module features two transistors for enhanced performance.
  • It includes an emitter controlled diode for improved efficiency.
  • Package type AG-IHVB130 provides robust mechanical design.
  • Maximum collector emitter saturation voltage is 3.25 V for low conduction losses.
  • Operates reliably in temperatures from -40°C to 150°C.
  • AlSiC base plate ensures increased thermal cycling capability.
  • Complies with IEC 60747, 60749, and 60068 standards.
  • Ideal for industrial power electronics and high power applications.

Product Description

Infineon FZ1600R33HE4BPSA1 is a high-power single IGBT module designed with advanced TRENCHSTOP™ IGBT4 technology and an emitter controlled diode, delivering superior electrical performance and reliability. Rated for a maximum continuous collector current of 1600 A and a voltage of 3300 V, this module is suited for demanding industrial power applications.

The device incorporates two transistors in a single switch configuration within the AG-IHVB130 package, allowing for efficient power conversion with minimal losses owing to its low saturation voltage of 3.25 V. Its robust AlSiC base plate contributes to enhanced thermal cycling endurance, vital for long-term industrial use.

Engineered to operate across a broad temperature range from -40°C to 150°C, this IGBT module meets stringent IEC 60747, 60749, and 60068 standards, ensuring compliance with international quality and reliability benchmarks. It is not designed for automotive applications.

Typical applications include industrial motor drives, power supplies, renewable energy systems, and manufacturing automation equipment requiring reliable high-current switching devices.

This single IGBT module features two transistors for high current density. Emitter controlled diode enhances switching efficiency. AG-IHVB130 package provides high mechanical and thermal stability. Wide operating temperature range -40°C to 150°C offers adaptability.

Low saturation voltage (3.25 V) reduces overall power loss. Advanced AlSiC base plate improves thermal cycling capability. Conforms to IEC international standards for durability and safety. Optimized for heavy-duty industrial power electronics applications.

Explore the range of Infineon IGBT Modules and other power semiconductor components at EnvMart for reliable and efficient power management solutions.

Infineon Single IGBT Module 1600 A 3300 V TRENCHSTOP™ IGBT4 with Emitter Controlled Diode AG-IHVB130 FZ1600R33HE4BPSA1
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Frequently Asked Questions

The maximum continuous collector current for this module is 1600 A.

This IGBT module has a maximum collector emitter voltage rating of 3300 V.

The configuration of this module is single, featuring two transistors in a single switch setup.

The maximum collector emitter saturation voltage is 3.25 V.

It operates reliably within a temperature range of -40°C to 150°C.

This model uses the AG-IHVB130 package type, which provides robust mechanical design.

It complies with IEC standards 60747, 60749, and 60068.

The height of this module is 16.4 mm and the length is 109.9 mm.

The maximum gate emitter voltage is 20 V.

The maximum power dissipation for this IGBT module is 3600 kW.

It is suitable for industrial motor drives, power supplies, renewable energy systems, and manufacturing automation equipment.

The AlSiC base plate enhances thermal cycling capability, contributing to the module's reliability in demanding applications.

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