Samtec FTSH Series Vertical Surface PCB Header 26 Contacts 1.27 mm Pitch 2 Row Unshrouded FTSH-113-01-L-DV-P-TR

Samtec FTSH-113-01-L-DV-P-TR is a vertical surface mount PCB header in the FTSH series, featuring 26 contacts arranged in 2 rows with a 1.27 mm pitch. The connector is unshrouded and designed for board-to-board connector applications in electronic circuits requiring robust connectivity.

The header supports electrical currents up to 3.4A, with contacts made from phosphor bronze and plated with light selective gold (0.000254 mm) in the contact area to ensure excellent signal integrity and corrosion resistance. The housing is fabricated from liquid crystal polymer, providing thermal stability and mechanical durability across a temperature range of -55°C to 125°C.

This connector incorporates solder termination and a male contact gender, making it ideal for precise, automated printed circuit assembly. The dual-row vertical design maximizes pin density while maintaining a compact footprint, suitable for various industrial and commercial electronic applications including computing, communications, and instrumentation.

The product is supplied on tape and reel packaging to facilitate automated pick and place mounting during manufacturing assembly lines, enhancing production efficiency and minimizing handling damage.

Supports a maximum current of 3.4A for reliable electrical performance. Constructed with a phosphor bronze contact material plated with gold for enhanced conductivity. Featuring a vertical orientation with dual row configuration for compact PCB footprint.

Housing made from liquid crystal polymer ensuring high temperature resistance between -55°C and 125°C. Designed for board-to-board connector systems using a solder termination type. Unshrouded contact gender is male providing ease of connection.

Packaged on tape and reel to facilitate automated pick and place assembly processes.

This Samtec PCB header is well-suited for industrial electronics manufacturing, including electronics components assembly, telecommunications hardware, laboratory instruments, and embedded system boards. Its robust design and materials ensure long-lasting performance in demanding environments.

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