Samtec Right Angle Surface PCB Header 3 Contacts 2.54 mm Pitch 1 Row Shrouded SIR1

Samtec SIR1 model right angle surface PCB header is a high-quality, shrouded, 3-contact connector with a 2.54 mm pitch designed for board-to-board applications. The phosphor bronze contacts provide durability and are plated with silver and tin to ensure consistent conductivity. This surface mount component supports a maximum current rating of 2.6 amps per pin and operates efficiently in harsh environments, within a temperature range from -55°C to 125°C. The housing is made from liquid crystal polymer, offering excellent mechanical strength and temperature resistance.

This PCB header with one row of contacts and shrouded housing ensures secure and reliable electrical connection in electronic assemblies. Its right angle orientation enables more compact and efficient PCB layouts, commonly used in industrial electronics, computing equipment, communication devices, and instrumentation.

Ideal for industrial and commercial electronics manufacturing, this Samtec SIR1 connector offers high performance and reliability. Its solder termination type facilitates straightforward PCB assembly processes. The connector system is board-to-board, making it suitable for stacked or parallel PCB configurations.

2.54 mm pitch for precise connector spacing. 3 contacts designed for efficient power and signal transfer. Phosphor bronze contact material ensures durability. Silver and tin plating deliver excellent electrical conductivity.

Operating temperature range from -55°C to +125°C for versatility. Liquid crystal polymer housing offers mechanical robustness. Right angle orientation for improved PCB layout options. Shrouded to protect contacts from damage and contamination.

Samtec PCB Headers like the SIR1 series are integral components in electronic assemblies requiring robust board-to-board interconnections. EnvMart offers this product to support engineering and manufacturing requirements in various sectors including industrial automation, telecommunications, data processing, and embedded systems.