Samtec LSHM Series Right Angle Surface PCB Header, 80 Contacts, 0.5 mm Pitch, 2 Row, Shrouded LSHM-140-01-L-RH-A-S-K-TR

The Samtec LSHM series model LSHM-140-01-L-RH-A-S-K-TR is a high-density right angle surface mount PCB header designed for rugged board-to-board electrical connections. Featuring 80 male contacts arranged in 2 rows with a fine 0.5 mm pitch, this shrouded connector system ensures secure and reliable mating in demanding applications.

Manufactured with a liquid crystal polymer housing, this header offers excellent thermal stability and mechanical robustness. The phosphor bronze contacts plated with gold provide superior conductivity and corrosion resistance, making it suitable for industrial, electronic, and communications equipment.

The connector operates at currents up to 2 amperes and voltages of 160 to 226 V AC, accommodating a wide range of signal and power requirements. Its operating temperature range from -55°C to +125°C allows deployment in extreme environments, typical in industrial, HVAC, manufacturing, and laboratory equipment.

The right angle orientation and surface mounting style facilitate compact PCB layouts and ease of assembly. The shrouded design protects contacts from damage and ensures accurate alignment during mating and unmating cycles.

This PCB header supports a current rating of 2A for reliable electrical performance. Constructed with a liquid crystal polymer housing for durability and heat resistance. Phosphor bronze contact material plated with gold ensures excellent conductivity.

Right angle orientation and surface mount type facilitate versatile PCB designs. Operates in a wide temperature range from -55°C to 125°C for harsh environments. Mating and unmating forces are approximately 4-6 times greater than typical micro pitch connectors.

Designed for board-to-board connector applications with 80 contacts arranged in 2 rows. Shrouded connector system provides enhanced protection and alignment during mating.

This connector is ideal for use in electronic assemblies, industrial control systems, telecommunications, and data equipment where high-density, reliable interconnect solutions are required. Its robust design and fine pitch meet modern demands for compactness and performance.

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