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| Country of Origin | India |
|---|---|
| Voltage | 475V |
| Brand | Samtec |
| Orientation | Vertical |
| Current | 5.4A |
| Model | TSM-104-04-L-DV |
| Mount Type | Surface |
| Housing Material | Liquid Crystal Polymer |
| Contact Material | Phosphor Bronze |
| Series | TSM |
| Termination Type | Solder |
| Maximum Operating Temperature | 125°C |
| Minimum Operating Temperature | -55°C |
| Number of Rows | 2 |
| Pitch | 2.54mm |
| Contact Plating | Gold |
| Number of Contacts | 8 |
| Contact Gender | Male |
| Shrouded/Unshrouded | Unshrouded |
| Connector System | Board-to-Board |
Samtec TSM-104-04-L-DV is a high-quality vertical surface mount pin header designed for reliable electronic board-to-board connections. Featuring 8 male contacts arranged in 2 rows with a 2.54 mm pitch, it provides solid mechanical stability and electrical performance for electronic assembly tasks.
The connector housing is made from durable black liquid crystal polymer, providing excellent thermal stability and insulating properties. Contacts are formed from phosphor bronze and plated with 0.25 μm gold on the post and matte tin on the tail, ensuring excellent conductivity and corrosion resistance.
This unshrouded header is optimized for surface mount technology (SMT) processes, with solder termination designed to promote strong mechanical solder joints. Its vertical orientation facilitates straightforward board stacking or connection.
The operating temperature range from -55°C to +125°C allows this component to suit demanding industrial, laboratory, electronic manufacturing, and telecommunications applications. It supports a voltage rating of 475 V AC and a current rating of 5.4 A, compliant with typical PCB header standards.
Key features such as male contact gender, 2 row configuration, and unshrouded design make it ideal for flexible, compact PCB interconnections where space and signal integrity are critical.
Liquid crystal polymer housing guarantees thermal durability and electrical insulation. Gold-plated phosphor bronze contacts ensure reliable signal conduction. Compact 2.54 mm pitch spacing supports industry-standard PCB layouts.
Unshrouded vertical design aids easy mating and assembly in dense PCB configurations. Suitable for industrial, manufacturing, electronics assembly, and prototyping use cases. This Samtec TSM series pin header belongs to the PCB Headers category on EnvMart, providing high-quality components for electronics manufacturers and designers.
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