JST PUD Series Right Angle Through Hole PCB Header, 14 Contact(s), 2 mm Pitch, 2 Row, Shrouded S14B-PUDSS-1(LF)(SN)

JST S14B-PUDSS-1(LF)(SN) PCB Header is a high-performance right angle, through hole connector designed for PCB wire-to-board applications. It offers 14 contacts arranged in 2 rows with a 2 mm pitch, ensuring a compact and stable electrical connection.

Constructed with copper alloy contacts plated in tin, this connector provides excellent electrical conductivity and durability in demanding industrial environments. The shrouded design enhances connector protection and secures mating with an audible locking click mechanism for reliable operation.

Rated for 3A current and 250V voltage, this connector supports a wide temperature range from -25°C to 85°C, making it ideal for electronic equipment exposed to varying thermal conditions.

The through hole mount facilitates robust soldered connections typically used in industrial, automation, and electronic manufacturing settings. The right angle layout optimizes PCB space, suitable for compact device designs.

Manufactured in Japan, the connector meets stringent quality requirements for electronics components requiring stable contact performance even in high vibration environments. High density double row wire-to-board connector.

2.0 mm pitch ensuring compact PCB integration. Shrouded design providing secure connection and protection. Through hole mounting for reliable soldered joints. Contact material of copper alloy with tin plating for conductivity and durability.

Operates reliably between -25°C and 85°C temperature range. Rated for 3A current and 250V voltage applications. Male contact gender with solder termination type. Right angle orientation for space-saving on PCB layouts. Manufactured in Japan adhering to quality standards.

This PCB Header is suitable for industrial electronics, electronic manufacturing, automation control, and equipment requiring reliable wire-to-board connections. Its robust design ensures stable electrical contact and resistance to mechanical stress and environmental factors.

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