Samtec T1M Series Straight Surface PCB Header 2 Contact 1 mm Pitch 1 Row Shrouded T1M-02-F-SV-L

The Samtec T1M-02-F-SV-L is a high-quality straight surface-mount PCB header from the T1M series, engineered to provide secure and efficient connectivity in electronic assemblies. Featuring 2 male contacts arranged in a single row with a 1 mm pitch, this connector is optimized for compact PCB designs and wire-to-board connector requirements. Its natural LCP housing material offers excellent thermal and mechanical stability, while the phosphor bronze contact material with silver and tin plating ensures enhanced conductivity and corrosion resistance.

This PCB header supports a current rating of 3.3 A per pin, suitable for low to moderate power applications. The operating temperature range from -10°C to 85°C allows it to perform reliably in various industrial, commercial, and laboratory environments. Its shrouded configuration provides added protection and precise mating, reducing the risk of damage during handling and installation.

Ideal for use in electronic components, power and control connectors, and wire housings, the Samtec T1M series PCB headers facilitate efficient assembly and reliable operation in demanding applications. The surface mount termination type simplifies PCB assembly processes using standard soldering techniques.

Pitch of 1 mm with 2 male contacts arranged in 1 row. Natural LCP housing material ensures durability and heat resistance. Phosphor bronze contacts plated with silver and tin for superior electrical conductivity. Current rating of 3.3 A per pin suitable for various low to medium power circuits.

Surface mount design for efficient PCB integration. Operating temperature range from -10°C to 85°C suitable for varied environments. Shrouded connector enhances protection and precision during mating.

This PCB header is highly suitable for industrial, laboratory, electronics manufacturing, and commercial applications requiring reliable wire-to-board connections. It supports a voltage rating up to 250 V and provides a robust interconnect solution in compact form factors.

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