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STMicroelectronics 2-Element ESD Protection Array 6-Pin QFN Surface Mount HSP061-2M6

Category ESD Protection Diode Brand STMicroelectronics Condition New

Specifications

Country of Origin India
Brand STMicroelectronics
Height 0.55mm
Length 1.45mm
Model HSP061-2M6
Width 1mm
Mount Type Surface
Series HSP061
Maximum Operating Temperature 150°C
Package Type QFN
Minimum Operating Temperature -40°C
Pin Count 6
Number of Elements per Chip 2
Clamping Voltage VC 18V
Diode Configuration Complex Array
Minimum Breakdown Voltage Vbr 6V
Maximum Reverse Stand-off Voltage Vwm 3V
Maximum Peak Pulse Current Ippm 3A
Maximum Reverse Leakage Current 100nA

Key Features

  • The device features a complex diode array configuration for effective transient voltage suppression.
  • Minimum breakdown voltage of 6 volts ensures reliable performance under voltage spikes.
  • Designed for surface mount applications with a small footprint of 1.45 mm length, 1 mm width, and 0.55 mm height.
  • Capable of handling peak pulse currents up to 3 amperes for robust protection capability.
  • Operating temperature range from -40°C to 150°C supports demanding industrial environments.
  • Low maximum reverse leakage current of 100 nA reduces power loss during standby.
  • The 2-element per chip design supports dual-line protection in compact applications.
  • Package type QFN aids in efficient PCB mounting and thermal dissipation.

Product Description

STMicroelectronics HSP061-2M6 2-Element ESD Protection Array is engineered for protecting sensitive electronic components against electrostatic discharge damage. This device integrates two diode elements in a complex array configuration to clamp transient voltages effectively. It is packaged in a compact 6-pin Quad Flat No-Lead (QFN) surface mount package, measuring 1.45 mm by 1 mm by 0.55 mm, suitable for high-density PCB designs.

The device features a minimum breakdown voltage of 6 volts and a maximum reverse stand-off voltage of 3 volts, providing reliable suppression against voltage spikes. It can withstand peak pulse currents up to 3 amperes, making it fit for use in environments with high transient voltage events. Operating over a temperature range from -40°C to 150°C, the protection array is suitable for diverse industrial and commercial electronic equipment applications.

The low maximum reverse leakage current of 100 nA ensures minimal power consumption in standby mode. With two elements per chip, this ESD protection array can secure dual high-speed data lines simultaneously, often required in modern electronic interfaces and communication systems.

This product is designed primarily for PCB surface mounting, offering easy integration into electronic assemblies. However, it does not conform to specific automotive standards, so it is recommended for general-purpose industrial and consumer electronics use.

The device configuration includes a complex diode array for transient voltage suppression. Compact QFN package supports efficient PCB mounting and thermal management. Wide operating temperature range accommodates various industrial environments.

High peak pulse current capability enhances device robustness. Low leakage current minimizes effect on system power efficiency. Two element design supports dual-line ESD protection. Excellent choice for protecting sensitive circuits in communications, computing, and consumer electronics.

This component is ideal for engineers designing robust electronic protection into high-speed data line applications. Explore more semiconductor components and ESD protection solutions on EnvMart for your industrial and commercial electronic design needs.

Explore more products in our ESD Protection Diode category.

STMicroelectronics 2-Element ESD Protection Array 6-Pin QFN Surface Mount HSP061-2M6
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Frequently Asked Questions

The minimum breakdown voltage is 6 volts, ensuring reliable performance during voltage spikes.

It can handle peak pulse currents up to 3 amperes, providing robust protection capability.

The operating temperature range is from -40°C to 150°C, suitable for demanding industrial environments.

The dimensions of the QFN package are 1.45 mm in length, 1 mm in width, and 0.55 mm in height.

This model features two elements per chip, allowing for dual-line protection in compact applications.

The maximum reverse leakage current is 100 nA, which helps reduce power loss during standby.

It is designed for surface mounting, making it suitable for high-density PCB designs.

The clamping voltage (VC) is 18 volts, which is important for effective transient voltage suppression.

The diode configuration is a complex array, designed for effective clamping of transient voltages.

This product is not designed to conform to specific automotive standards and is recommended for general-purpose industrial and consumer electronics use.

It is suitable for protecting sensitive circuits in communications, computing, and consumer electronics.

The country of origin is India.

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