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Molex FSB3 Series Vertical Surface PCB Socket, 30-Contact, 2 Row, 0.4 mm Pitch Surface Mount FSB3
Specifications
| Country of Origin | Japan |
|---|---|
| Brand | Molex |
| Orientation | Vertical |
| Current | 300mA |
| Model | FSB3 |
| Mount Type | Surface |
| Housing Material | Liquid Crystal Polymer |
| Contact Material | Copper Alloy |
| Series | FSB3 |
| Termination Type | Surface Mount |
| Maximum Operating Temperature | 125°C |
| Sub Type | Board-to-Board Connector |
| Minimum Operating Temperature | -40°C |
| Number of Rows | 2 |
| Pitch | 0.4mm |
| Standards/Approvals | CHINA RoHS, EU RoHS |
| Contact Plating | Gold |
| Number of Contacts | 30 |
| Contact Gender | Female |
| Connector System | Signal, Board-to-Board |
| Stacking Height | 3mm |
| Row Pitch | 1.8mm |
Key Features
- Constructed with liquid crystal polymer housing for durability.
- Supports a current rating of 300mA for reliable electrical connections.
- Features gold-plated copper alloy contacts ensuring excellent conductivity.
- Vertical orientation with a stacking height of 3 mm to optimize board layouts.
- Operates reliably between -40°C and 125°C for broad environmental tolerance.
- Offers a compact 1.8 mm row pitch for space-saving designs.
- Complies with CHINA RoHS and EU RoHS environmental standards.
- Manufactured in Japan ensuring high quality and performance.
Product Description
The Molex FSB3 Series Vertical Surface PCB Socket, model FSB3, is a high-precision 30-contact, 2-row connector designed for board-to-board signal applications with a compact 0.4 mm pitch. Its surface mount termination and vertical orientation allows for efficient use of PCB real estate in industrial and commercial electronics assemblies.
Constructed with a durable liquid crystal polymer housing, the connector is engineered to withstand temperatures ranging from -40°C to 125°C, making it suitable for demanding environments. The contacts are made from copper alloy and plated with gold, ensuring excellent conductivity and resistance to corrosion, enhancing lifespan and performance.
This connector supports a current rating of 300mA, making it ideal for signal connection in compact electronic devices and systems. The stacking height of 3 mm and a row pitch of 1.8 mm enable dense and reliable packaging within boards, maximizing connectivity while minimizing space.
Compliant with CHINA RoHS and EU RoHS standards, the FSB3 series PCB sockets meet strict environmental regulations. Designed and manufactured in Japan, this product maintains stringent quality standards for use in electronic manufacturing, laboratory instruments, telecommunications, and industrial machinery.
Liquid crystal polymer housing ensures robustness and thermal stability. Gold plating on copper alloy contacts guarantees reliable electrical conductivity. Vertical surface mount design optimizes PCB layout efficiency. RoHS compliant for environmental safety and regulatory requirements.
Broad operating temperature range from -40°C to 125°C suitable for various conditions. Compact 30-contact, 2-row configuration with 0.4 mm pitch for tight integration.
This PCB Socket is a crucial component in the electronics assembly industry for applications requiring high-density, reliable board interconnections. Explore the molex category at EnvMart for compatible accessories and related electronic components.
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Frequently Asked Questions
This model supports a current rating of 300mA, making it suitable for reliable electrical connections in compact electronic devices.
The FSB3 features a compact pitch of 0.4 mm, allowing for tight integration in board layouts.
It is constructed with a liquid crystal polymer housing and features copper alloy contacts that are gold-plated for excellent conductivity.
The FSB3 operates reliably between -40°C and 125°C, making it suitable for various environmental conditions.
This connector has 30 contacts arranged in a 2-row configuration, designed for board-to-board signal applications.
The stacking height of the FSB3 is 3 mm, which helps optimize board layouts in electronic assemblies.
Yes, it complies with CHINA RoHS and EU RoHS environmental standards, ensuring it meets strict regulatory requirements.
The FSB3 features a surface mount termination type, suitable for efficient PCB assembly.
This model has a vertical orientation, which aids in maximizing PCB real estate.
It is a signal, board-to-board connector designed for high-density interconnections.
The FSB3 is manufactured in Japan, ensuring high quality and performance standards.
The row pitch of the FSB3 is 1.8 mm, allowing for space-efficient designs in electronic applications.
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