Samtec TMM Series Straight Through Hole Pin Header, 4 Contact(s), 2 mm Pitch, 1 Row, Unshrouded TMM-104-01-G-S

Samtec TMM-104-01-G-S Straight Through Hole Pin Header is a high-quality PCB connector designed for board-to-board and wire-to-board applications. This pin header features 4 male contacts arranged in a single row with a 2 mm pitch, ensuring precise and compact interconnections in electronic assemblies.

Constructed using robust liquid crystal polymer housing and phosphor bronze contacts plated with gold, the connector offers reliable electrical conductivity and excellent durability. The 3.2 mm long mating posts and 3.5 mm tail pins are gold plated to maintain signal integrity and resist corrosion, suitable for demanding industrial and commercial environments.

Its operating temperature range extends from -55°C to 125°C, making it ideal for use in harsh conditions such as industrial automation, telecommunications, consumer electronics manufacturing, and other electronic assemblies requiring stable performance under thermal stress. The through-hole mounting provides solid mechanical strength on the PCB.

This TMM Series low profile pin header stands at 2.77 mm in height, optimizing space on crowded PCBs. It mates seamlessly with several Samtec socket series including SQT, SQW, TLE, SMM, and MMS, offering versatile connectivity options.

Features 4 male gold-plated contacts with high conductivity. Housed in black liquid crystal polymer for excellent durability. Single row, 2 mm pitch configuration. Rated for 3.9A current and up to 500V voltage. Operating temperature range: -55°C to +125°C.

Through hole termination for secure PCB mounting. Low profile height of 2.77 mm. Compatible with multiple mating socket series. Gold plating ensures corrosion resistance and signal integrity.

This product is widely used in electronics manufacturing, telecommunications, industrial equipment, and other applications where reliable PCB connectivity is essential. The TMM Series pin headers offer a robust, low profile, and high-performance solution for electronic component interconnection challenges.

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