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Samtec TFM Series Straight Surface PCB Header, 60 Contacts, 1.27 mm Pitch, 2 Row, Shrouded TFM-130-02-S-D-WT
Specifications
| Country of Origin | India |
|---|---|
| Voltage | 350V |
| Brand | Samtec |
| Orientation | Straight |
| Current | 5A |
| Model | TFM-130-02-S-D-WT |
| Mount Type | Surface |
| Housing Material | Liquid Crystal Polymer |
| Contact Material | Phosphor Bronze |
| Series | TFM |
| Termination Type | Solder |
| Maximum Operating Temperature | 125°C |
| Minimum Operating Temperature | -55°C |
| Number of Rows | 2 |
| Pitch | 1.27mm |
| Contact Plating | Gold |
| Number of Contacts | 60 |
| Contact Gender | Male |
| Shrouded/Unshrouded | Shrouded |
| Connector System | Board-to-Board, Wire-to-Board |
Key Features
- Features a shrouded, straight orientation for secure mating and alignment.
- Constructed with Liquid Crystal Polymer housing for thermal stability.
- Phosphor bronze contacts plated with gold for reliable current conduction at 5A.
- Operates within a wide temperature range of -55°C to 125°C.
- Supports a maximum voltage of 350V and uses solder termination for assembly.
- Male contact gender and surface mounting ensure compatibility with various PCB systems.
- Designed for board-to-board and wire-to-board connector systems enhancing versatile applications.
- Compact TFM series format with 5.72 mm body height for space saving on printed circuit boards.
Product Description
Samtec TFM-130-02-S-D-WT is a premium surface mount PCB header connector featuring 60 gold-plated male contacts arranged in two rows with a 1.27 mm pitch. It employs a shrouded design for enhanced protection and precise connector alignment, ensuring excellent electrical performance and mechanical reliability.
Its Liquid Crystal Polymer housing material provides excellent thermal resistance, enabling operation in harsh environments with temperatures ranging from -55°C to 125°C. The phosphor bronze contacts with gold plating offer a durable conduction path supporting current levels up to 5A and voltage up to 350V, suitable for various electronic assemblies.
This TFM Series connector is optimized for board-to-board and wire-to-board applications, utilizing surface mount technology and solder termination to facilitate efficient PCB assembly.
The connector's compact size with a 5.72 mm body height balances mechanical strength and space efficiency, making it ideal for industrial, automotive, telecommunications, and consumer electronics manufacturing environments.
Shrouded straight orientation for secure alignment. Liquid Crystal Polymer housing for excellent thermal properties. Gold plated phosphor bronze contacts rated at 5A current capacity. Operating temperature from -55°C to 125°C ensures reliability.
Surface mount with solder termination for robust assembly. Supports 350V voltage rating suitable for diverse applications. Designed for board-to-board and wire-to-board connection systems. Compact design with 5.72 mm body height for space conservation.
This connector is widely employed in industrial and electronics manufacturing contexts such as industrial automation, telecommunications, and automotive electronics where reliable electrical connections and compact design are critical.
For browsing more connectors and related components, explore the Electronics & Electricals category on EnvMart.
Explore more products in our PCB Headers category.
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Frequently Asked Questions
This model supports a current rating of up to 5A, making it suitable for various electronic applications.
The maximum voltage rating for this connector is 350V, which is appropriate for diverse electronic assemblies.
It operates within a temperature range of -55°C to 125°C, ensuring reliability in harsh environments.
The housing is made from Liquid Crystal Polymer, while the contacts are made of phosphor bronze with gold plating for reliable conduction.
This model features 60 contacts arranged in two rows, with a pitch of 1.27 mm.
It utilizes solder termination, which facilitates robust assembly on printed circuit boards.
This connector has a straight orientation, designed for secure mating and alignment.
It is designed for both board-to-board and wire-to-board connection systems, enhancing its versatility in applications.
The body height of this unit is 5.72 mm, allowing for space-saving on printed circuit boards.
The country of origin for this connector is India.
The shrouded design provides enhanced protection and precise alignment during connection, improving overall performance.
It is widely employed in industrial automation, telecommunications, and automotive electronics, where reliable connections are essential.
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