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Samtec TSM Series Vertical Surface Mount Pin Header 10 Contacts 2.54 mm Pitch 2 Row Unshrouded TSM-105-04-S-DV

Category PCB Headers Brand Samtec Condition New

Specifications

Country of Origin India
Voltage 475V
Brand Samtec
Orientation Vertical
Current 5.4A
Model TSM-105-04-S-DV
Mount Type Surface
Housing Material Liquid Crystal Polymer
Contact Material Phosphor Bronze
Series TSM
Termination Type Solder
Maximum Operating Temperature 125°C
Minimum Operating Temperature -55°C
Number of Rows 2
Pitch 2.54mm
Contact Plating Gold
Number of Contacts 10
Contact Gender Male
Shrouded/Unshrouded Unshrouded
Connector System Board-to-Board

Key Features

  • Constructed with liquid crystal polymer housing for durability and thermal stability.
  • Phosphor bronze contact material plated with 0.76 μm gold for reliable conductivity.
  • Designed for operating temperatures from -55°C to 125°C.
  • Surface mount termination with solder type for secure attachment.
  • Supports a voltage rating of 475 V and a current rating of 5.4 A.
  • Unshrouded vertical orientation enables easy board stacking and connection.
  • Suitable for PCB and electronic component applications requiring robust connections.

Product Description

The Samtec TSM series vertical surface mount pin header, model TSM-105-04-S-DV, is engineered for high reliability in electronic assembly and PCB interconnections with 10 contacts spaced at a 2.54 mm pitch arranged over 2 rows in a vertical, unshrouded configuration.

This pin header features a housing made of liquid crystal polymer that provides excellent chemical and thermal resistance, ensuring performance within the range of -55°C to 125°C ambient temperatures. The pins themselves are phosphor bronze plated with 0.76 μm gold on the posts and matte tin on the tails, providing superior conductivity and corrosion resistance essential for long-term durability.

The product is designed for surface mount technology (SMT) termination through soldering, facilitating ease of mounting on printed circuit boards. Rated for a voltage of 475 V and a current carrying capacity of 5.4 A, it is suitable for a broad range of PCB interconnect applications where secure board-to-board connections are required.

With its unshrouded design and male contact gender, the header allows for versatile mechanical and electrical connections in industrial, commercial, and manufacturing electronics contexts.

Durable liquid crystal polymer housing ensures chemical and temperature resistance. Gold-plated phosphor bronze contacts deliver reliable electrical performance. Wide operating temperature range supports diverse environmental conditions.

Surface mount solder termination for efficient PCB assembly. Rated for 475 V and 5.4 A performance, suitable for power and signal lines. Vertical orientation with 2 rows and 10 contacts for compact board layout. Unshrouded construction enables flexibility in mating connector configurations.

This pin header is ideal for electronics manufacturing, industrial control systems, and laboratory equipment requiring durable, high-performance PCB connectors. Explore the full range of Samtec PCB Headers at EnvMart for your next project.

Samtec TSM Series Vertical Surface Mount Pin Header 10 Contacts 2.54 mm Pitch 2 Row Unshrouded TSM-105-04-S-DV
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Frequently Asked Questions

The voltage rating of this pin header is 475 V.

It has a current rating of 5.4 A.

This pin header features a pitch of 2.54 mm and has 10 contacts arranged in 2 rows.

It uses a solder termination type for secure attachment to PCBs.

The operating temperature range is from -55°C to 125°C.

The contacts are made of phosphor bronze and are plated with 0.76 μm gold for reliable conductivity.

This model has a vertical orientation.

It features an unshrouded design, allowing for flexible mating configurations.

The housing is constructed from liquid crystal polymer, providing durability and thermal stability.

This pin header is manufactured in India.

It supports a board-to-board connector system.

This pin header is suitable for PCB and electronic component applications requiring robust connections.

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