Samtec TSW Series Straight Through Hole Pin Header, 3 Contacts, 2.54 mm Pitch, 1 Row, Unshrouded TSW-103-07-S-S

Samtec TSW-103-07-S-S is a durable Straight Through Hole Pin Header featuring 3 male contacts arranged in a single row with a 2.54 mm pitch. Designed for board-to-board and wire-to-board connector systems, it uses phosphor bronze contacts with gold plating ensuring excellent conductivity and long-term reliability.

The pin header is constructed with a glass filled polyester housing that withstands temperatures from -55°C up to 125°C and supports a maximum voltage rating of 465 V and current rating of 4.7 A, making it ideal for industrial, electronic manufacturing, and custom electronic assembly applications.

This through-hole mount connector offers solder termination type and an unshrouded profile, facilitating easy access during installations in printed circuit boards (PCBs) and various electronic devices.

Special features include multiple plating and ruggedizing options allowing optimization of cost and performance for varying needs. The compact 0.025" square post contacts in vertical orientation make it suitable for high-density and reliable connections in complex electronic systems.

Manufactured in the United States, the TSW-103-07-S-S is a quality component for industries requiring dependable PCB header connectors. Supports a current rating of 4.7 A for robust electrical performance. Constructed with glass filled polyester housing for enhanced durability.

Features phosphor bronze contacts plated with gold for superior conductivity and corrosion resistance. Designed for through-hole solder termination ensuring secure mounting. Operates reliably across a temperature range from -55°C to 125°C.

Rated for a voltage of 465 V, meeting demanding electrical standards. Compact 0.025" (0.635 mm) square post contact system with vertical straight orientation. Unshrouded design allows easy access for mating connectors. Manufactured in the United States following strict quality controls.

Offers options for cost and performance optimization with various plating and ruggedizing features.

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