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Samtec TSW Series Straight Through Hole Pin Header, 24 Contacts, 2.54 mm Pitch, 3 Row, Unshrouded TSW-108-25-T-T
Specifications
| Country of Origin | India |
|---|---|
| Voltage | 550V |
| Brand | Samtec |
| Orientation | Straight |
| Model | TSW-108-25-T-T |
| Mount Type | Through Hole |
| Special Features | Many options fo |
| Housing Material | Glass Filled Polyester |
| Contact Material | Phosphor Bronze |
| Series | TSW |
| Termination | Through-hole |
| Termination Type | Solder |
| Maximum Operating Temperature | 125°C |
| Minimum Operating Temperature | -55°C |
| Number of Rows | 3 |
| Pitch | 2.54mm |
| Contact Plating | Gold |
| Number of Contacts | 24 |
| Contact Gender | Male |
| Shrouded/Unshrouded | Unshrouded |
| Connector System | Board-to-Board |
| Contact System | .025" (0.635 mm) square post |
Key Features
- Constructed with glass filled polyester housing for durability.
- Phosphor bronze contacts plated with gold ensure reliable conductivity.
- Rated for operation from -55°C to 125°C temperature range.
- Designed for industry standard board-to-board connector system.
- Features male contact gender with solder termination type.
- Unshrouded design eases soldering and inspection.
Product Description
Samtec TSW-108-25-T-T series straight through hole pin header features 24 contacts arranged in 3 rows with a 2.54 mm pitch, manufactured with a glass-filled polyester housing known for mechanical strength and heat resistance. The phosphor bronze contact material with gold plating provides excellent electrical performance and corrosion resistance, making this connector suitable for demanding industrial electronic applications.
Operating temperature ranges from -55°C up to 125°C, allowing reliability in harsh environmental conditions. The connector is designed for board-to-board connectivity with a male contact gender and solder termination, facilitating through-hole mount assembly. Rated for 550 volts, it supports a variety of power and signal transmission uses.
This unshrouded header design enables easy access for soldering and inspection during manufacturing. It is widely used in electronics manufacturing, prototyping, and repair, spanning industries such as industrial machinery, communications, computing, and embedded systems.
The TSW series offers a broad range of standard pin counts, lengths, and configurations to provide flexibility in design. Samtec’s rigorous quality controls ensure that connectors meet high performance standards, though no formal certifications are indicated for this specific model.
Constructed with glass filled polyester housing for durability. Phosphor bronze contacts plated with gold ensure reliable conductivity. Rated for operation from -55°C to 125°C temperature range. Designed for industry standard board-to-board connector system.
Features male contact gender with solder termination type. Voltage rating up to 550V suitable for various electronic applications. Unshrouded design eases soldering and inspection.
This pin header is ideal for use in electronics manufacturing, industrial control, communication devices, and embedded system assemblies. Browse additional connectors and PCB header options in the Electronics & Electricals category at EnvMart for your specific project requirements.
Explore more products in our PCB Headers category.
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Frequently Asked Questions
The pitch of the Samtec TSW-108-25-T-T pin header is 2.54 mm.
This model features 24 contacts arranged in 3 rows.
The maximum operating temperature for this connector is 125°C.
This pin header is rated for a voltage of up to 550V.
The housing is made of glass-filled polyester, and the contacts are made of phosphor bronze with gold plating.
It features a solder termination type for through-hole mounting.
The contact gender of this model is male.
Yes, it is designed for board-to-board connectivity.
The minimum operating temperature for this pin header is -55°C.
The orientation of this connector is straight.
This product is manufactured in India.
It is suitable for use in electronics manufacturing, industrial control, communication devices, and embedded system assemblies.
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