Samtec HTSW Series Straight Through Hole Pin Header, 7 Contacts, 2 Row, 2.54 mm Pitch, Unshrouded HTSW-107-07-T-D

Samtec HTSW-107-07-T-D is a premium straight through hole pin header from the HTSW series designed for high temperature applications. It features 7 contacts arranged in 2 rows with a 2.54 mm pitch, making it ideal for precise electronic component interfacing in industrial and electronic manufacturing setups.

The housing material is a natural liquid crystal polymer renowned for its excellent thermal stability and mechanical strength, enabling reliable operation under extreme conditions between -55°C and 125°C. The unshrouded, male contacts crafted from phosphor bronze and plated with gold provide superior conductivity and corrosion resistance.

This pin header supports through hole mounting techniques suited for both board-to-board and wire-to-board connector systems, widely utilized in electronics assembly for durable and secure connections.

Rated for a maximum voltage of 550 V, this component meets demanding power and signal requirements found in industrial electronics, automation, and control systems. The housing is made of durable liquid crystal polymer ensuring high temperature resistance.

Contacts are male gender constructed from phosphor bronze with gold plating for reliable connectivity. This connector supports through hole mounting suitable for board-to-board and wire-to-board systems. Operates efficiently across a wide temperature range from -55°C to 125°C.

Rated for voltages up to 550 V, suitable for various industrial electronic applications. The row pitch matches the 2.54 mm standard ensuring compatibility with standard PCBs. Contact termination is solder type providing robust mechanical and electrical connection.

This pin header is ideal for industrial electronics, manufacturing, automation systems, and other applications requiring reliable, high-temperature capable board connectivity. Samtec's commitment to quality and robust designs ensures consistent performance to support demanding operational environments.

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