Winslow 2.54 mm Pitch Vertical 32 Way Through Hole Turned Pin Open Frame DIL Socket 5A W30532TRC

Winslow W30532TRC 2.54 mm Pitch Vertical 32 Way Through Hole Turned Pin Open Frame DIL Socket is engineered for high-quality, reliable electronic connector applications. It supports current ratings up to 5A, ideal for various industrial, laboratory, and electronic assembly environments.

This DIL socket features a vertical orientation with a 2.54 mm pitch and 32 contacts arranged in an open frame design for efficient heat dissipation and ease of access during development and testing. The housing is made of fibreglass reinforced polyethylene terephthalate (PBT) delivering robustness and stability in demanding applications.

The contacts are machined with a four-finger gold (0.3 μm) over nickel plating and tin-plated brass outer shell, providing excellent electrical conductivity and resistance to corrosion. The contact material consists of beryllium copper alloy, ensuring high mechanical endurance and reliability.

Capable of enduring a temperature range from -55°C to +125°C, and rated up to a maximum of 150°C operating temperature, this socket delivers durability in harsh environments. It supports up to 1000 insertions, making it suitable for non-permanent PCB socketing during prototyping and debugging stages.

32 contacts with 5A current rating. Through hole solder termination type for secure PCB mounting. Gold over nickel contact plating for superior conductivity and corrosion resistance. Fibreglass reinforced PBT housing for mechanical strength.

Open frame design aids cooling and easy IC placement. Vertical orientation with 2.54 mm pitch spacing. Dimensions approximately 40.56 mm (L) x 17.66 mm (W) x 3 mm (D). Temperature range of -55°C to +125°C with maximum operating temperature of 150°C.

1000 insertion durability for development and testing. Beryllium copper alloy contact material for mechanical resilience.

This DIL Socket is highly suited for industrial electronics, laboratory prototyping, manufacturing test fixtures, and commercial electronic assembly processes. It provides a reliable interface for IC chips during design validation before permanent soldering.

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