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Samtec SEAF Series Straight Surface PCB Socket 120-Contact 6 Row 1.27 mm Pitch Solder SEAF-20-05.0-S-06-2-A-K-TR

Category PCB Socket Brand Samtec Condition New

Specifications

Country of Origin India
Voltage 240V
Brand Samtec
Orientation Straight
Current 2.7A
Model SEAF-20-05.0-S-06-2-A-K-TR
Mount Type Surface
Housing Material Liquid Crystal Polymer
Contact Material Copper
Series SEAF
Termination Type Solder
Maximum Operating Temperature 125°C
Sub Type High Speed High Density Open-Pin-Field Array Socket
Minimum Operating Temperature -55°C
Number of Rows 6
Pitch 1.27mm
Contact Plating Gold
Number of Contacts 120
Contact Gender Female
Connector System Board-to-Board
Stacking Height 18.5mm
Row Pitch 2.5mm

Key Features

  • This PCB socket features high density open-pin-field array design optimized for high speed signal integrity.
  • It supports a current rating of 2.7 A and voltage up to 240 V.
  • The housing is made of liquid crystal polymer for durability and thermal resistance.
  • Contacts are female, plated with gold over copper for reliable connectivity.
  • Mounting is surface type with solder termination and straight orientation.
  • The stacking height is 18.5 mm suitable for board-to-board connections.
  • Operating temperature range spans from -55°C to 125°C ensuring performance in harsh environments.
  • The row pitch is 2.5 mm and pitch grid is 1.27 mm x 1.27 mm.

Product Description

Samtec SEAF-20-05.0-S-06-2-A-K-TR is a high performance straight surface mount PCB Socket designed for board-to-board connector applications. Featuring 120 contacts arranged in 6 rows, this socket is engineered with a 1.27 mm pitch and a row pitch of 2.5 mm to optimize high density connections.

The socket employs a rugged Edge Rate® contact system, which is signal integrity optimized and offers low insertion and extraction forces, ideal for reliable high-speed data transfer up to 28+ Gbps. The contact material is copper with gold plating, ensuring excellent conductivity and corrosion resistance.

Its housing is manufactured from liquid crystal polymer, providing outstanding mechanical strength and thermal stability, allowing operation between -55°C and 125°C. The socket is mounted via surface mount technology with solder type termination and features a stacking height of 18.5 mm, making it suitable for compact PCB assembly.

This socket supports a maximum current rating of 2.7 Amperes and a voltage rating of 240 Volts, applicable in demanding industrial and electronic manufacturing applications including communications, computing, and instrumentation systems.

High speed, high density open-pin-field array socket design with 120 contacts. Rugged Edge Rate® contacts with gold plating for superior signal integrity. Liquid crystal polymer housing for durability and temperature tolerance.

Surface mount solder termination with straight orientation. Stacking height of 18.5 mm supports efficient board stacking. Wide operating temperature range from -55°C to 125°C. Designed for board-to-board connector systems requiring high reliability.

Samtec SEAF series offers dependable performance for industrial, manufacturing, and high-speed electronic applications. Explore the extensive range of Samtec connectors and sockets on EnvMart for your project requirements.

Samtec SEAF Series Straight Surface PCB Socket 120-Contact 6 Row 1.27 mm Pitch Solder SEAF-20-05.0-S-06-2-A-K-TR
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Frequently Asked Questions

This PCB socket supports a current rating of 2.7 Amperes.

The voltage rating for this model is up to 240 Volts.

It operates within a temperature range of -55°C to 125°C.

This socket features 120 contacts arranged in 6 rows.

The pitch of the contacts is 1.27 mm.

It uses solder termination for mounting.

The housing is made from liquid crystal polymer, providing durability and thermal resistance.

The stacking height is 18.5 mm, suitable for board-to-board connections.

The contacts are made of copper and are plated with gold for reliable connectivity.

This socket has a straight orientation for surface mounting.

It supports a board-to-board connector system, making it suitable for high-density applications.

This socket is designed for high-speed data transfer applications, including communications, computing, and instrumentation systems.

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