Winslow Straight Through Hole Mount 2.54 mm Pitch IC Socket Adapter QFN to DIP W13063RC

Winslow W13063RC is a high-quality IC Socket Adapter designed for converting QFN (Quad Flat No-Leads) packages to DIP (Dual In Line Package) format. It features a 2.54 mm pitch between contacts and supports through-hole mounting with a straight orientation, suitable for PCB applications.

This adapter is equipped with 10 female contacts on the QFN side and 10 male contacts on the DIP side, facilitating reliable electrical connection and seamless package conversion. The contacts are made of brass, which provides excellent conductivity and corrosion resistance, while the housing is constructed from fibreglass to ensure durability and stability during installation and operation.

Ideal for developers and manufacturing environments, this adapter range, known as 'Adaptics', reduces development costs by allowing hardware redesign flexibility between package styles without PCB redesigns. It supports Dual-Flat No-Leads (DFN) and Quad-Flat No-Leads (QFN) packages, enabling versatile testing and prototyping of ICs.

Manufactured in the United Kingdom, W13063RC ensures compliance with quality manufacturing standards, although it does not have specific formal approvals listed. The adapter features a straight through-hole mount with a 2.54 mm pitch.

Connections include 10 female contacts on QFN and 10 male contacts on DIP. Brass contact material ensures reliable electrical conduction. Fibreglass housing provides mechanical strength and insulation. Designed for converting QFN and DFN packages to DIP format, facilitating hardware prototyping and adaptation.

This IC Socket Adapter is well-suited for electronics manufacturing, laboratory prototyping, and development workflows requiring flexible package adaptation. Browse EnvMart’s IC Socket Adapter category for compatible accessories and related electronic components.